F4BTMS High Frequency PCB
Introduction
The F4BTMS series is an upgraded version of the F4BTM series.
Building upon its foundation, significant technological
advancements have been made in material formulation and
manufacturing processes. The material now incorporates a large
amount of ceramics and utilizes ultra-thin and ultra-fine
fiberglass cloth reinforcement. These enhancements have greatly
improved the material's performance, resulting in a wider range of
dielectric constants. It is a high-reliability material suitable
for aerospace applications, capable of replacing similar foreign
products.
By incorporating a small amount of ultra-thin and ultra-fine
fiberglass cloth reinforcement, along with a significant and
uniform mixture of special nanoceramics and polytetrafluoroethylene
resin, the fiberglass effect during the propagation of
electromagnetic waves is minimized, reducing dielectric loss and
enhancing dimensional stability. The material exhibits reduced
anisotropy in the X/Y/Z directions, allowing for higher frequency
usage, increased electrical strength, and improved thermal
conductivity. The material also possesses excellent low coefficient
of thermal expansion and stable dielectric temperature
characteristics.
The F4BTMS series comes standard with RTF low roughness copper
foil, which not only reduces conductor loss but also provides
excellent peel strength. It can be paired with copper-based or
aluminum-based options.
F4BTMS294 can be combined with buried 50Ω resistor copper foil to
create a resistor film substrate.
The circuit boards can be processed using standard PTFE board
fabrication techniques, taking advantage of the excellent
mechanical and physical properties of the material. They are
suitable for multi-layer, high-layer-count, and backplane
processing. Additionally, they exhibit excellent processability in
dense hole and fine line routing.
Product Features
- Minimal dielectric constant tolerance and excellent
batch-to-batch consistency.
- Extremely low dielectric loss.
- Stable dielectric constant and low loss within frequencies up to
40GHz, meeting the requirements of phase-sensitive applications.
- Excellent temperature coefficient of dielectric constant and
dielectric loss, maintaining frequency and phase stability between
-55°C and 150°C.
- Excellent resistance to radiation, retaining stable dielectric
and physical properties even after exposure to irradiation.
- Low outgassing performance, meeting the vacuum outgassing
requirements for aerospace applications.
- Minimal thermal expansion coefficients in the X/Y/Z directions,
ensuring dimensional stability and reliable hole copper
connections.
- Improved thermal conductivity, suitable for high-power
applications.
- Excellent dimensional stability.
- Low water absorption.
Models & Data Sheet
| Product Technical Parameters | Product Models & Data Sheet |
| Product Features | Test Conditions | Unit | F4BTMS220 | F4BTMS233 | F4BTMS255 | F4BTMS265 | F4BTMS294 | F4BTMS300 | F4BTMS350 | F4BTMS430 | F4BTMS450 | F4BTMS615 | F4BTMS1000 |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.00 | 3.50 | 4.30 | 4.50 | 6.15 | 10.20 |
| Dielectric Constant Tolerance | / | / | ±0.02 | ±0.03 | ±0.04 | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.09 | ±0.09 | ±0.12 | ±0.2 |
| Dielectric Constant (Design) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.0 | 3.50 | 4.3 | 4.5 | 6.15 | 10.2 |
| Loss Tangent (Typical) | 10GHz | / | 0.0009 | 0.0010 | 0.0012 | 0.0012 | 0.0012 | 0.0013 | 0.0016 | 0.0015 | 0.0015 | 0.0020 | 0.0020 |
| 20GHz | / | 0.0010 | 0.0011 | 0.0013 | 0.0014 | 0.0014 | 0.0015 | 0.0019 | 0.0019 | 0.0019 | 0.0023 | 0.0023 |
| 40GHz | / | 0.0013 | 0.0015 | 0.0016 | 0.0018 | 0.0018 | 0.0019 | 0.0024 | 0.0024 | 0.0024 | / | / |
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -130 | -122 | -92 | -88 | -20 | -20 | -39 | -60 | -58 | -96 | -320 |
| Peel Strength | 1 OZ RTF copper | N/mm | >2.4 | >2.4 | >1.8 | >1.8 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >34 | >40 | >40 | >42 | >44 | >45 | >48 | >23 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >35 | >38 | >40 | >42 | >48 | >52 | >55 | >52 | >54 | >55 | >42 |
| Coefficientof Thermal Expansion (X, Y direction) | -55 º~288ºC | ppm/ºC | 40, 50 | 35, 40 | 15, 20 | 15, 20 | 10, 12 | 10, 11 | 10, 12 | 13, 12 | 12, 12 | 10, 12 | 16, 18 |
| Coefficientof Thermal Expansion (Z direction) | -55 º~288ºC | ppm/ºC | 290 | 220 | 80 | 72 | 22 | 22 | 20 | 47 | 45 | 40 | 32 |
| Thermal Stress | 260℃, 10s,3 times | / | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | 0.02 | 0.02 | 0.025 | 0.025 | 0.02 | 0.025 | 0.03 | 0.08 | 0.08 | 0.1 | 0.03 |
| Density | Room Temperature | g/cm3 | 2.18 | 2.22 | 2.26 | 2.26 | 2.25 | 2.28 | 2.3 | 2.51 | 2.53 | 2.75 | 3.2 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.26 | 0.28 | 0.31 | 0.36 | 0.58 | 0.58 | 0.6 | 0.63 | 0.64 | 0.67 | 0.81 |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Material Composition | / | / | PTFE,Ultra-thin and ultra-fine (quartz) fiberglass. | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. |
Our PCB Capability (F4BTMS)
| PCB Capability (F4BTMS) |
| PCB Material: | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. |
| Designation (F4BTMS ) | F4BTMS | DK (10GHz) | DF (10 GHz) |
| F4BTMS220 | 2.2±0.02 | 0.0009 |
| F4BTMS233 | 2.33±0.03 | 0.0010 |
| F4BTMS255 | 2.55±0.04 | 0.0012 |
| F4BTMS265 | 2.65±0.04 | 0.0012 |
| F4BTMS294 | 2.94±0.04 | 0.0012 |
| F4BTMS300 | 3.0±0.04 | 0.0013 |
| F4BTMS350 | 3.5±0.05 | 0.0016 |
| F4BTMS430 | 4.3±0.09 | 0.0015 |
| F4BTMS450 | 4.5±0.09 | 0.0015 |
| F4BTMS615 | 6.15±0.12 | 0.0020 |
| F4BTMS1000 | 10.2±0.2 | 0.0020 |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil),
0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil),
1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil),
2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil),
5.08mm(200mil), 6.35mm(250mil) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure
gold, ENEPIG etc.. |
A F4BTMS PCB and Typical Applications:
Presented on the screen is an F4BTMS high-frequency PCB, utilizing
a 3.2mm substrate with HASL coating on the pads. F4BTMS PCBs are
extensively employed in various domains, including:
- Aerospace and aviation equipment, space installations, and cabin
setups.
- Microwave and RF applications.
- Radar systems, particularly in applications.
- Feed networks for signal distribution.
- Phase-sensitive antennas and phased array antennas.
- Satellite communications, and much more.
Final (F4BTMS series aluminum-based/copper-based boards)
This series of laminates can provide aluminum-based or copper-based
materials, where one side of the dielectric layer is covered with
copper foil, and the other side is covered with an aluminum-based
or copper-based layer. This configuration serves as shielding or
heat dissipation.
The model numbers are F4BTMS***-AL or F4BTMS***-CU. For example,
F4BTMS220-AL represents F4BTMS220 with aluminum-based substrate.
F4BTMS294-CU represents F4BTMS294 with copper-based substrate.
