Hello Everyone,
Today we’re talk about RO3010 high frequency PCBs.
RO3010 high frequency circuit laminates are ceramic-filled PTFE
composites intended for using in commercial microwave and RF
applications. Its obvious characteristic is that the electrical
performance is exceptional and the mechanical property is stable
and consistent. This allows our designer to develop multi-layer
board without encountering warpage or reliability problems.
More features and applications are as follows:
1, Excellent mechanical properties versus temperature, it’s
reliable stripline and multi-layer board constructions.
2, Uniform mechanical properties, it’s suitable for use with epoxy
glass multi-layer board hybrid designs.
3, Low in-plane expansion coefficient matches to copper, it allows
for more reliable surface mounted assemblies; ideal for
applications sensitive to temperature change and exhibit excellent
dimensional stability.
| PCB Capability |
| PCB Material: | Ceramic-filled PTFE composite |
| Designation: | RO3010 |
| Dielectric constant: | 10. 2 ±0.3 (process) |
| 11.2 (design) |
| Layer count: | 2 Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 5mil (0.127mm), 10mil (0.254mm), |
| 25mil (0.635mm), 50mil (1.27mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP etc.. |
| | |
RO3010 high frequency PCBs are available with double sided,
multi-layer and hybrid construction, 0.5oz to 2oz finished copper,
0.13 mm to 1.3mm thick, maximum size 400 mm by 500mm, surface
finish with bare copper, hot air leveling, immersion gold etc.
Typical applications are
1. Automotive radar applications
2. GPS Antennas
3. Power amplifiers and antennas
4. Patch antennas for wireless communications
5. Direct broadcast satellite
The basic colour of RO3010 PCB is white.
The manufacturing process of RO3010 high frequency PCB is similar
to standard PTFE PCB, so it’s suitable for volume manufacturing
process winning advantageous market. Should you have any questions,
please feel free to contact us.
Thank you for your reading.
Appendix: Typical Value of RO3010
| Property | RO3010 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 10.2±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 11.2 | Z | | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor,tanδ | 0.0022 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | -395 | Z | ppm/℃ | 10 GHz -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Dimensional Stability | 0.35
0.31 | X
Y | mm/m | COND A | IPC-TM-650 2.2.4 |
| Volume Resistivity | 105 | | MΩ.cm | COND A | IPC 2.5.17.1 |
| Surface Resistivity | 105 | | MΩ | COND A | IPC 2.5.17.1 |
| Tensile Modulus | 1902
1934 | X
Y | MPa | 23℃ | ASTM D 638 |
| Moisture Absorption | 0.05 | | % | D48/50 | IPC-TM-650 2.6.2.1 |
| Specific Heat | 0.8 | | j/g/k | | Calculated |
| Thermal Conductivity | 0.95 | | W/M/K | 50℃ | ASTM D 5470 |
Coefficient of Thermal Expansion
(-55 to 288℃) | 13
11
16 | X
Y
Z | ppm/℃ | 23℃/50% RH | IPC-TM-650 2.4.4.1 |
| Td | 500 | | ℃ TGA | | ASTM D 3850 |
| Density | 2.8 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 9.4 | | Ib/in. | 1oz,EDC After Solder Float | IPC-TM 2.4.8 |
| Flammability | V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
