Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On
12mil 0.305mm RO4003C and FR-4
(Printed circuit boards are custom-made products, the picture and
parameters shown are just for reference)
Hello everyone,
Warm greetings!
Today we’re introducing a type of 6-layer RF PCB built on 12mil
RO4003C and FR-4. This board is used for satellite antenna.
Following drawing is the stack-up of the board.
Viewing from the stack-up, the 12mil core is on the top layer and
it mainly plays the roles of signal layer. The core has fixed
thickness which is very important to the electrical length of RF
lines on the circuit board. The rest layers are FR-4 epoxy glass
material with similar thickness with RO4003C.
The detailed specifications are as follows.
Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4
Dielectric constant: 3.38+/-0.05
Layer count: 6 layers
Via type: Through holes
Format: 105mm x 80mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm / Inner layer 18μm
Solder mask / Legend: Green / White
Final PCB height: 1.4 mm
Others: Impedance controlled PCB
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
At present, the mature mixed pressing materials are as follows:
RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
RT/duroid 5880 + RO4350B
RT/duroid 5880 + FR4
Thank you for your reading. You’re welcome to contact us for your
RF PCB enquiries.
Appendix: Our PCB Capability 2022
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535,
RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880;
RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC;
TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35;
RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0,
TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65
DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15,
DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240;
FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4
High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger,
Pure gold plated etc. |
