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Shenzhen Bicheng Electronics Technology Co., Ltd

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Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB from wholesalers
     
    Buy cheap Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB from wholesalers
    • Buy cheap Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB from wholesalers
    • Buy cheap Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB from wholesalers
    • Buy cheap Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB from wholesalers
    • Buy cheap Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB from wholesalers

    Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-500-V0.13
    Certification : UL
    Price : USD 2.99-8.99 PER PIECE
    Payment Terms : T/T, Western Union
    Supply Ability : 45000 pieces per month
    Delivery Time : 10 working days
    • Product Details
    • Company Profile

    Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

    Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.



    Key Features

    1. Excellent electrical properties

    2. Dielectric constant less than 3.5

    3. Dissipation factor less than 0.010

    4. Excellent, stable and flat Dk/Df performance

    5. Compatible with most FR-4 processes

    6. Lead free process compatible

    7. Improved z-axis thermal expansion

    8. Anti-CAF capability

    9. Superior dimensional stability, thickness uniformity and flatness

    10. Excellent through-hole and soldering reliability


    Our PCB Capabilities (TU-872 SLK Sp)

    PCB Material:High performance modified epoxy FR-4 resin
    Designation:TU-872 SLK Sp
    Dielectric constant:< 3.5
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
    PCB thickness:10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
    Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

    Main Applications

    1. Radio Frequency

    2. Backpanel, High performance computing

    3. Line cards, Storage

    4. Servers, Telecom, Base station

    5. Office Routers


    Our Advantages

    ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

    16000㎡ workshop;

    30000㎡ output capability per month;

    Prototype to large volume production capability

    IPC Class 2 / IPC Class 3;

    Any layer HDI PCBs;

    Delivery on time: >98%

    Customer complaint rate: <1%


    Typical Properties (TU-872 SLK Sp)

    Typical ValuesConditioningIPC-4101 /126
    Thermal
    Tg (DMA)220°C
    Tg (DSC)200°C> 170°C
    Tg (TMA)190°CE-2/105
    Td (TGA)340°C> 340°C
    CTE x-axis12~15 ppm/°CN/A
    CTE y-axis12~15 ppm/°CE-2/105N/A
    CTE z-axis2.30%< 3.0%
    Thermal Stress,Solder Float, 288°C> 60 secA> 10 sec
    T26060 min> 30 min
    T28820 minE-2/105> 15 min
    T3005 min> 2 min
    Flammability94V-0E-24/12594V-0
    DK & DF
    Permittivity (RC 50%) @10GHz3.5
    Loss Tangent (RC 50%) @10GHz0.008
    Electrical
    Permittivity (RC50%)
    1GHz (SPC method/4291B)3.6/3.4< 5.2
    5GHz (SPC method)3.5E-2/105-
    10GHz (SPC method)3.5-
    Loss Tangent (RC50%)
    1GHz (SPC method/4291B)0.006/0.004
    5GHz (SPC method)0.007E-2/105< 0.035
    10GHz (SPC method)0.008
    Volume Resistivity> 1010 MΩ•cmC-96/35/90> 106 MΩ•cm
    Surface Resistivity> 108 MΩC-96/35/90> 104 MΩ
    Electric Strength> 40 KV/mmA> 30 kV/mm
    Dielectric Breakdown> 50 kVAN/A
    Mechanical
    Young’s Modulus
    Warp Direction26 GPaAN/A
    Fill Direction24 GPa
    Flexural Strength
    Lengthwise> 60,000 psiA> 60,000 psi
    Crosswise> 50,000 psiA> 50,000 psi
    Peel Strength, 1.0 oz RTF Cu foil4~7 lb/inA> 4 lb/in
    Water Absorption0.13%E-1/105+D-24/23< 0.5 %
    Quality Low Dk / Df FR-4 PCB High Thermal Reliability Printed Circuit Board (PCB) TU-872 Multilayer PCB for sale
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