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Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick from wholesalers
     
    Buy cheap Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick from wholesalers
    • Buy cheap Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick from wholesalers
    • Buy cheap Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick from wholesalers
    • Buy cheap Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick from wholesalers

    Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick

    Ask Lasest Price
    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-xxx-V1.36
    Certification : UL
    Price : USD 2.88-6.99 per piece
    Payment Terms : T/T, Paypal
    Supply Ability : 45000 pieces per month
    Delivery Time : 4-5 working days
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    Rogers 6002 PCB RT/duroid 6002 High Frequency PCB 10mil thick, 20mil thick, 30mil thick, 60mil thick, 120mil thick

    Hello everyone,
    Today, we talk about the high frequency PCB made on RT/duroid 6002 material.

    The RT/ duroid ® 6002 microwave material is a kind of low loss and low dielectric constant laminate, which can meet the strict requirements for mechanical reliability and electrical stability in complex microwave structural design. The main components are PTFE ceramics composites.

    The dielectric constant of RT/duroid ®6002 has excellent resistance to temperature change between -55 ℃ and 150 ℃, which can meet the requirements of filter, oscillator and delay line application design for its electrical stability.


    The main advantages are:
    Firstly, low loss ensures excellent high Frequency performance
    Secondly, excellent mechanical and electrical properties, reliable multi-layer board construction.
    Thirdly, extremely low thermal coefficient of dielectric constant,ensure excellent dimensional stability.
    Fourthly, in-plane expansion coefficient matched to copper, allows for more reliable surface mounted assemblies.
    Fifthly, low outgassing, ideal for space applications


    Typical applications are:
    Phased Array Antennas
    Round Based and Airborne Radar Systems
    GPS antennas
    Power Backplanes
    Commercial Airline Collision Avoidance

    The base copper of RT/druoid PCB has 0.5oz, 1oz and 2oz; the thickness of PCB board is wide, ranging from 5mil to 120mil to be considered by our designers.

    PCB Capability (RT/duorid 6002)

    PCB Material:Ceramic-filled PTFE composite
    Designation:RT/duroid 6002
    Dielectric constant:2.94 ±0.04 (process)
    2.94 (design)
    Layer count:2 Layer, Multilayer
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
    PCB thickness:10mil (0.254mm), 20mil (0.508mm)
    30mil (0.762mm), 60mil (1.524mm), 120mil (3.048mm)
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP etc..
      


    The basic colour of RT/duroid 6002 PCB is white.

    RT/duroid 6002 PCB is very suited to the equipment of flat and non-planar structures, such as antennas, complex multi-layer circuits with inner-layer connections, and microwave circuits for aerospace designs in hostile environments.

    If you have any questions, please feel free to contact us. Thank you for your reading.

    Appendix:

    RT/duroid 6002 Typical Value
    PropertyRT/duroid 6002DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess2.94±0.04Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Dielectric Constant,εDesign2.948GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0012Z10 GHz/23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+12Zppm/℃10 GHz 0℃-100℃IPC-TM-650 2.5.5.5
    Volume Resistivity106ZMohm.cmAASTM D 257
    Surface Resistivity107ZMohmAASTM D 257
    Tensile Modulus828(120)X,YMPa(kpsi)23℃ASTM D 638
    Ultimate Stress6.9(1.0)X,YMPa(kpsi)
    Ultimate Strain7.3X,Y%
    Compressive Modulus2482(360)ZMPa(kpsi)ASTM D 638
    Moisture Absorption0.02%D48/50IPC-TM-650 2.6.2.1
    ASTM D 570
    Thermal Conductivity0.6W/m/k80℃ASTM C518
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    16
    16
    24
    X
    Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.41
    Td500℃ TGAASTM D 3850
    Density2.1gm/cm3ASTM D 792
    Specific Heat0.93(0.22)j/g/k
    (BTU/ib/OF)
    Calculated
    Copper Peel8.9(1.6)Ibs/in.(N/mm)IPC-TM-650 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes





































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