RO4534 High Frequency Printed Circuit Board 20mil 30mil 60mil
RO4534 Antenna PCB With Immersion Gold, Silver and Tin
(Printed Circuit Boards are custom-made products, the picture and
parameters shown are just for reference)
General Description
RO4534 High Frequency Laminates are ceramic-filled,
glass-reinforced hydrocarbon based material which are
cost/performance materials from Rogers Corporation, specifically
engineered and manufactured to meet the specific demands of the
antenna markets. It has a dielectric constant of 3.4 and a loss
tangent (Df) of 0.0027 measured at 10 GHz. These values allow
antenna designers to realize substantial gain values while
minimizing signal loss. Thus, it provides excellent passive
intermodulation response required for mobile infrastructure
microstrip antenna applications.
It is an affordable alternative to more conventional PTFE antenna
technologies, thus allowing our designers to optimize the price and
performance of the antennas. The resin systems of RO4534 dielectric
materials are designed to provide the necessary properties for
ideal antenna performance. The coefficients of thermal expansion
(CTEs) in both the X and Y directions are similar to that of
copper. The good CTE match reduces stresses in the printed circuit
board antenna.
Features and Benefits
1. Low Loss 0.0027 , Low Dk 3.4, low PIM response: Wide range of
application use
2. Thermoset resin system: Compatible with standard PCB fabrication
3. Excellent dimensional stability: Greater yield on larger panels
sizes
4. Uniform mechanical properties: Maintains mechanical form during
handling
5. High thermal conductivity: Improved power handling
Typical Applications:
1. Cellular infrastructure base station antennas
2. WiMAX antenna networks
Our PCB Capability (RO4534)
| PCB Material: | Ceramic-filled, Glass-reinforced Hydrocarbon |
| Designation: | RO4534 |
| Dielectric constant: | 3.4 |
| Dissipation Factor | 0.0027 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure
gold plated etc.. |
RO4534 Typical Values
| Property | RO4534 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.4 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.0022 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0027 | 10 GHz/23℃ |
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.3 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 11 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 14 | Y |
| 46 | Z |
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 6.3 (1.1) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | NON FR | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
