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TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action from wholesalers
     
    Buy cheap TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action from wholesalers
    • Buy cheap TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action from wholesalers
    • Buy cheap TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action from wholesalers
    • Buy cheap TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action from wholesalers

    TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action

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    Brand Name : Bicheng Enterprise Limited
    Model Number : BIC-0298-V2.98
    Certification : UL
    Price : USD2 .99-7.99 per piece
    Payment Terms : T/T,Paypal
    Supply Ability : 50000 PIECE PER MONTH
    Delivery Time : 8-9 WORKING DAY
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    TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action

    TC600 Microwave PCB: Supercharging Thermal Management for High-Power RF Action


    Hey there! Get ready to meet the TC600 laminate from Rogers, a PTFE-based composite that's all about turbocharging thermal management while giving those pesky dielectric and insertion losses the boot. In this blog post, we'll dive into the awesome properties of TC600 material, exploring its electrical, thermal, mechanical, and physical characteristics.


    TC600 Typical Properties

    Dielectric Constant: TC600 rocks a dielectric constant of 6.15 at 1.8 MHz (resonant cavity method) and 10 GHz (IPC TM-650 testing). That's some impressive electrical mojo!


    Dissipation Factor: When it comes to loss, TC600 is a champ. With a dissipation factor of 0.0017 at 1.8 GHz and 0.002 at 10 GHz (IPC TM-650), it keeps those losses in check.


    Temperature Coefficient of Dielectric Constant (TCDk): TC600's dielectric constant stays cool across a wide temperature range, thanks to its TCDk value of 75 ppm/ºC. No wild swings here!


    Electrical Properties: TC600 is an electrifying performer! It has killer volume and surface resistivity, with an electrical strength of 850 Volts/mil or 34 Kv/mm. It laughs in the face of dielectric breakdown, handling a whopping 62 kilovolts. And when it comes to arc resistance, it's a marathon runner with over 240 seconds of endurance.


    Thermal Properties: TC600 is a hotshot when it comes to thermal performance. It can take the heat with a decomposition temperature exceeding 512 °C. Plus, it's got serious staying power with time-to-delamination values (T260, T288, T300) all lasting over 60 minutes. Talk about reliability!

    Mechanical Properties: TC600 is one tough cookie. It's got a peel strength of 10 lb/in, a Young's modulus of 280 kpsi, a flexural strength of 9.6 kpsi, and a tensile strength of 5.0 kpsi. It's built to withstand the toughest challenges.


    Physical Properties: TC600 is cool, calm, and collected. It barely sips water with just 0.02% absorption. Its density is 2.9 g/cm³, and it's a thermal conductor with a Z-direction thermal conductivity of 1.1 W/mK. And hey, it's got a flammability rating of 94V0! Safety first.


    PCB Capability (TC600)

    We've got a whole lineup of TC600 PCB options that'll blow your mind. Whether you need a single-sided, double-sided, multilayer, or hybrid setup, we've got you covered. And we're not limited in thickness either. Choose from 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), or 60mil (1.524mm) to suit your fancy.


    And hey, customization is the name of the game. We offer copper weights of 1oz (35µm) and 2oz (70µm) so you can dial in your design just right. Need some extra room? Our PCBs go up to ≤400mm X 500mm. There's plenty of space to play.


    Want to add some personality? We've got solder mask colors to match your style—green, black, blue, yellow, red—you name it! And let's not forget the finish. Go for immersion gold, hot air soldering level (HASL), immersion silver, immersion tin, bare copper, OSP, pure gold plated, or whatever tickles your fancy.


    A Piece of TC600 PCB

    Check out this sweet 30mil TC600 microwave PCB. It's rockin' a bold blue solder mask and some slick immersion silver on the pads. It's as eye-catching as it is functional.


    Conclusion

    When it comes to high-power RF applications, TC600 PCBs are the stuff of legends. They're the secret sauce for optimizing thermal management and taking your performance to the next level.


    With its killer combo of high thermal conductivity, low loss tangent, low coefficient of thermal expansion (CTE), and temperature phase stability, TC600 is a force to be reckoned with. It's the power boost your high-power applications have been waiting for.


    So, whether you're rocking power amplifiers, filters, couplers, microwave combiners, power dividers, small footprint antennas, digital audio broadcasting (DAB) antennas, GPS systems, or handheld RFID reader antennas, TC600 PCBs have got your back.


    Thanks for joining us on this wild ride. We hope you've enjoyed discovering the awesomeness of TC600, and we can't wait to share more mind-blowing insights with you in the future. Stay tuned!


    PCB Capability (TC600)

    PropertyUnitValueTest Method
    1. Electrical Properties
    Dielectric Constant (may vary by thickness)
    @1.8 MHz-6.15Resonant Cavity
    @10 GHz-6.15IPC TM-650 2.5.5.5
    Dissipation Factor
    @1.8 GHz-0.0017Resonant Cavity
    @10 GHz-0.002IPC TM-650 2.5.5.5
    Temperature Coefficient of Dielectric Constant: TCεr @ 10 GHz (-40-150°C)ppm/ºC-75IPC TM-650 2.5.5.5
    Volume Resistivity
    C96/35/90MΩ-cm1.6x109IPC TM-650 2.5.17.1
    E24/125MΩ-cm2.4x108IPC TM-650 2.5.17.1
    Surface Resistivity
    C96/35/903.1x109IPC TM-650 2.5.17.1
    E24/1259.0x108IPC TM-650 2.5.17.1
    Electrical StrengthVolts/mil (kV/mm)850 (34)IPC TM-650 2.5.6.2
    Dielectric BreakdownkV62IPC TM-650 2.5.6
    Arc Resistancesec>240IPC TM-650 2.5.1
    2. Thermal Properties
    Decomposition Temperature (Td)
    Initial°C512IPC TM-650 2.4.24.6
    5%°C572IPC TM-650 2.4.24.6
    T260min>60IPC TM-650 2.4.24.1
    T288min>60IPC TM-650 2.4.24.1
    T300min>60IPC TM-650 2.4.24.1
    Thermal Expansion, CTE (x,y) 50-150ºCppm/ºC9, 9IPC TM-650 2.4.41
    Thermal Expansion, CTE (z) 50-150ºCppm/ºC35IPC TM-650 2.4.24
    % z-axis Expansion (50-260ºC)%1.5IPC TM-650 2.4.24
    3. Mechanical Properties
    Peel Strength to Copper (1 oz/35 micron)
    After Thermal Stresslb/in (N/mm)10 (1.8)IPC TM-650 2.4.8
    At Elevated Temperatures (150ºC)lb/in (N/mm)10 (1.8)IPC TM-650 2.4.8.2
    After Process Solutionslb/in (N/mm)9 (1.6)IPC TM-650 2.4.8
    Young’s Moduluskpsi (MPa)280 (1930)IPC TM-650 2.4.18.3
    Flexural Strength (Machine/Cross)kpsi (MPa)9.60/9.30 (66/64)IPC TM-650 2.4.4
    Tensile Strength (Machine/Cross)kpsi (MPa)5.0/4.30 (34/30)IPC TM-650 2.4.18.3
    Compressive Moduluskpsi (MPa)ASTM D-3410
    Poisson’s Ratio-ASTM D-3039
    4. Physical Properties
    Water Absorption%0.02IPC TM-650 2.6.2.1
    Density, ambient 23ºCg/cm32.9ASTM D792 Method A
    Thermal Conductivity (z-axis)W/mK1.1ASTM E1461
    Thermal Conductivity (x, y)W/mK1.4ASTM E1461
    Specific HeatJ/gK0.94ASTM E1461
    FlammabilityclassV0UL-94
    NASA Outgassing, 125ºC, ≤10-6 torr
    Total Mass Loss%0.02NASA SP-R-0022A
    Collected Volatiles%0NASA SP-R-0022A
    Water Vapor Recovered%0NASA SP-R-0022A
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