Gold Finger PCB Gold-plated Edge Connector Circuit Board Hard Gold Contact Fingers PCB
(Printed circuits boards are custom-made products, the picture and
parameters shown are just for reference)
1.1 General description
This is a type of 8-layer printed circuit board built on FR-4
substrate with Tg 170°C for the application of Mobile Broadband.
It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask
(Taiyo) and Immersion gold on pads. 80 strips of gold fingers are
on edge for inserting usage.The base material is from Taiwan ITEQ
supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class
2 using supplied Gerber data. Each 25 boards are packed for
shipment.
1.2 Features and benefits
1. High Tg material shows excellent thermal reliability and CAF
resistance providing long-term reliability for industrial and
automobile application;
2. Gold fingers reduce contact resistance;
3. 16000㎡ workshop;
4. Meeting your PCB needs from prototype to mass production.
5. Strict WIP inspection and monitoring as well as working
instruction;
6. IPC Class 2 / IPC Class 3;
7. ISO9001, ISO14001, ISO13485, UL certified manufacturing factory;
8. Diversified shipping method: FedEx, DHL, TNT, EMS;
9. No MOQ, low cost for prototypes and small runs quantity.
1.3 PCB Specifications
| PCB SIZE | 150 x 141mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 8 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 18um(0.5oz)+plate TOP layer |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 1 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 2 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 3 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 4 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 35um(1oz) MidLayer 5 |
| FR-4 0.2mm |
| copper ------- 35um(1oz) MidLayer 6 |
| Prepreg 7628(43%) 0.195mm |
| copper ------- 18um(0.5oz)+plate BOT Layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.35/3.5mm |
| Number of Different Holes: | 23 |
| Number of Drill Holes: | 183 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| Number of Gold finger | 39 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG170℃ er<5.4 |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion gold on pad, electroplated gold on edge connectors |
| Solder Mask Apply To: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, Taiyo IJR-4000 MW300 |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
1.4 Applications
Bluetooth Transmitter
HDMI Splitters
CCTV Systems
Led Street Lights
Low Noise Amplifier
Door Access Control System
5G Mobile Hotspot
Multicoupler
Embedded Systems Development
Smart Phone and Cell Phone
1.5 Gold finger PCB
The Purpose is to establish electrical connection to the board
without using a two-part connector system. Plating of nickel and
gold is carried out in essentially the same way as plating copper
and tin/lead, i.e., by electrolytic deposition. Plating can be
carried out either manually or automatically. In the manual
process, boards are more or less stationary in the gold plating
bath, which causes a varying gold deposition along the row of
contact fingers. The result will frequently be a thickness
distribution with the outermost contact fingers having perhaps
twice as much deposited gold as the center contact fingers. In the
automatic process, gold plating takes place while the boards slide
through the plating cell. The method offers a gold thickness
variation that can be controlled within ± 5% or better. This is
because all contact fingers will be dealt with in exactly the same
way when the board moves through the process cell.
Edge connectors are frequently provided with a slot that serves to
guide the board with respect to the receptacle (locating slot)
and/or to prevent incorrect insertion of the board (polarization
slot). Usually, the PCB manufacturer prefers to route the slot
simultaneously with the contouring of the board. Obviously, this
requires that the slot be slightly wider than the router bit used.
In order to ease the insertion of the board into the receptacle,
the edge along the connector should be bevelled. The bevelling also
has the advantage of reducing the scraping of the contacts of the
receptacle when the board is inserted in the receptacle.
