18-Layer High-Frequency PCB – RO4350B + RO4450F Stackup for
RF/Microwave Applications
The newly shipped 18-layer high-frequency PCB is designed for
demanding RF and microwave applications, utilizing Rogers RO4350B
laminates and RO4450F bondply to achieve exceptional signal
integrity, thermal stability, and low-loss performance. It is
intended for mission-critical systems such as cellular base
stations, automotive radar, and satellite communications.
Compliance with IPC-Class 2 standards is ensured, and rigorous
electrical testing is conducted prior to shipment to guarantee
reliability.
Key Specifications:
- Materials: Rogers RO4350B (core) and RO4450F (bondply) are used.
- Layer Count: 18 layers are incorporated.
- Board Dimensions: 218 mm × 497 mm (±0.15mm tolerance) are
maintained.
- Thickness: A finished thickness of 3.2 mm is achieved.
- Copper Weight: 1 oz (35 μm) is applied to inner and outer layers.
- Trace/Space: 4/4 mils are supported.
- Minimum Hole Size: 0.4 mm is achieved with mechanical drilling.
- Blind Vias: L11–L18 are implemented.
- Surface Finish: Immersion Gold + Selective Hard Gold (50 μinch) is
applied.
- Solder Mask: Blue is used on top and bottom layers; white
silkscreen is printed.
- Via Treatment: Vias are resin-filled and capped; via-in-pad and
press-fit holes are included.
- Testing: 100% electrical testing is performed before shipment.
PCB Specifications
| PCB SIZE | 135 x 135mm=1PCS |
| BOARD TYPE | High frequency PCB, RF PCB |
| Number of Layers | Double sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+PLATE |
| RO4350B 60mil |
| copper ------- 35um(1oz)+PLATE |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11mil/12mil |
| Minimum / Maximum Holes: | 0.3/2.2mm |
| Number of Different Holes: | 5 |
| Number of Drill Holes: | 184 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 60mil, Tg 288℃ |
| Final foil external: | 1.5oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100
microinch nickel) |
| Solder Mask Apply To: | NO |
| Solder Mask Color: | NO |
| Solder Mask Type: | N/A |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | NO |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated Through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advanced Material Benefits:
✅ RO4350B Core:
Ultra-low loss is achieved (Dk = 3.48 ±0.05 @ 10 GHz, Df = 0.0037).
High thermal conductivity (0.69 W/m/°K) and Tg >280°C are
provided.
CTE is matched to copper (X/Y/Z: 10/12/32 ppm/°C) for reliable
plated through-holes.
✅ RO4450F Bondply:
A compatible dielectric (Dk = 3.52 ±0.05) is ensured for multilayer
stability.
Superior lateral flow is enabled for high-density interconnects.
Multiple sequential lamination cycles are supported.
Data sheet of Rogers 4350B (RO4350B )
| RO4350B Typical Value |
| Property | RO4350B | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 3.48±0.05 | Z | | 10 GHz/23℃ | IPC-TM-650 2.5.5.5 Clamped Stripline |
| Dielectric Constant,εDesign | 3.66 | Z | | 8 to 40 GHz | Differential Phase Length Method |
| Dissipation Factortan,δ | 0.0037
0.0031 | Z | | 10 GHz/23℃
2.5 GHz/23℃ | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of ε | +50 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 |
| Volume Resistivity | 1.2 x 1010 | | MΩ.cm | COND A | IPC-TM-650 2.5.17.1 |
| Surface Resistivity | 5.7 x109 | | MΩ | COND A | IPC-TM-650 2.5.17.1 |
| Electrical Strength | 31.2(780) | Z | Kv/mm(v/mil) | 0.51mm(0.020") | IPC-TM-650 2.5.6.2 |
| Tensile Modulus | 16,767(2,432)
14,153(2,053) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Tensile Strength | 203(29.5)
130(18.9) | X
Y | MPa(ksi) | RT | ASTM D 638 |
| Flexural Strength | 255
(37) | | MPa
(kpsi) | | IPC-TM-650 2.4.4 |
| Dimensional Stability | <0.5 | X,Y | mm/m
(mil/inch) | after etch+E2/150℃ | IPC-TM-650 2.4.39A |
| Coefficient of Thermal Expansion | 10
12
32 | X
Y
Z | ppm/℃ | -55℃to288℃ | IPC-TM-650 2.4.41 |
| Tg | >280 | | ℃ TMA | A | IPC-TM-650 2.4.24.3 |
| Td | 390 | | ℃ TGA | | ASTM D 3850 |
| Thermal Conductivity | 0.69 | | W/M/oK | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | | % | 48hrs immersion 0.060"
sample Temperature 50℃ | ASTM D 570 |
| Density | 1.86 | | gm/cm3 | 23℃ | ASTM D 792 |
| Copper Peel Stength | 0.88
(5.0) | | N/mm
(pli) | after solder float 1 oz.
EDC Foil | IPC-TM-650 2.4.8 |
| Flammability | (3)V-0 | | | | UL 94 |
| Lead-free Process Compatible | Yes | | | | |
Design and Manufacturing Excellence:
High-Density Interconnects: 632 vias and 779 pads (338 thru-hole, 441 SMT) are integrated.
Controlled Impedance: Tight Dk tolerance is maintained for consistent RF performance.
Robust Construction: Resin-filled vias and press-fit holes are included for mechanical
durability.
Typical Applications:
- Cellular base station antennas and power amplifiers
- Automotive radar (77 GHz) and RF sensors
- Satellite LNBs and aerospace systems
- High-speed digital RF designs
- Compliance & Documentation:
- Artwork Format: Gerber RS-274-X is supplied.
- Quality Standard: IPC-Class 2 is adhered to.
- Global Availability: Worldwide shipping is supported.
Why This PCB Is Selected
This PCB is engineered for high-frequency, high-power RF systems,
where Rogers’ advanced materials are leveraged to minimize signal
loss, enhance thermal management, and ensure long-term reliability
in harsh operating conditions.
For customization or volume pricing, inquiries are welcomed.
