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Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish

Shenzhen Bicheng Electronics Technology Co., Ltd
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    Buy cheap Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish from wholesalers
     
    Buy cheap Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish from wholesalers
    • Buy cheap Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish from wholesalers
    • Buy cheap Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish from wholesalers
    • Buy cheap Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish from wholesalers

    Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish

    Ask Lasest Price
    Brand Name : Rogers
    Model Number : RT Duroid 6002
    Certification : ISO9001
    Price : 0.99-99USD/PCS
    Payment Terms : T/T, Paypal
    Supply Ability : 50000pcs
    Delivery Time : 2-10 working days
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    Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish

    2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish


    Product Introduction

    We present our 2-Layer RT/duroid 6002 PCB – a premium high-frequency circuit board engineered for demanding microwave and RF applications. Fabricated with Rogers RT/duroid 6002 ceramic-filled PTFE laminate and finished with Immersion Silver, this 0.8mm (30mil) board delivers ultra-low loss (Df 0.0012 @ 10 GHz), exceptional dielectric constant stability (Dk 2.94 ±0.04), and outstanding dimensional stability. The absence of solder mask and silkscreen, combined with the Immersion Silver finish, provides a pure, low-loss RF path ideal for phased array antennas, radar systems, and space-grade electronics.



    Key Specifications

    ParameterDetails
    Base MaterialRogers RT/duroid 6002 (Ceramic-filled PTFE)
    Layer Count2 Layers (Double-sided)
    Finished Thickness0.8 mm (30 mil)
    Copper Weight1 oz (35 μm) on both outer layers
    Min Trace/Space6 / 7 mils
    Min Hole Size0.3 mm (Mechanical drilling)
    Via Plating Thickness20 μm
    Surface FinishImmersion Silver
    Solder MaskNone (Top & Bottom)
    SilkscreenNone (Top & Bottom)
    Electrical Test100% prior to shipment
    Artwork FormatGerber RS-274-X
    Accepted StandardIPC-Class-2
    AvailabilityWorldwide

    PCB Stackup (2-Layer Rigid)

    LayerMaterialThickness
    Top Copper1 oz (35 μm)
    SubstrateRogers RT/duroid 60020.762 mm (30 mil)
    Bottom Copper1 oz (35 μm)

    Note: No blind vias – all interconnections are through-hole vias. No solder mask or silkscreen ensures minimal signal interference for critical RF paths.


    PCB Statistics

    Dimensions: 156 mm × 87.9 mm (1 piece)

    Components: 94

    Total Pads: 241 (196 thru-hole, 45 SMT on top, 0 on bottom)

    Vias: 126

    Nets: 2 (Simple, high-performance RF signal paths)


    Why RT/duroid 6002?

    RT/duroid 6002 is a ceramic-filled PTFE composite engineered for complex microwave structures requiring a low dielectric constant and ultra-low loss. Unlike standard RF laminates, it offers a remarkably low thermal coefficient of Dk (12 ppm/°C), ensuring stable performance across wide temperature swings. With a decomposition temperature (Td) of 500°C and low out-gassing characteristics, it is ideally suited for space applications and other mission-critical environments.


    Key Features of RT/duroid 6002

    ParameterValue
    Dielectric Constant (Dk)2.94 ±0.04 @ 10 GHz
    Thermal Coefficient of Dk12 ppm/°C
    Dissipation Factor (Df)0.0012 @ 10 GHz
    Td (Decomposition Temp.)500°C (TGA)
    Thermal Conductivity0.6 W/m/K
    CTE – Z axis24 ppm/°C
    Moisture Absorption0.02% (ultra-low)

    Benefits of This RT/duroid 6002 PCB


    Ultra-Low Loss: Df of 0.0012 at 10 GHz minimizes insertion loss – ideal for long RF traces and high-sensitivity receivers.


    Tight Dk Control: ±0.04 tolerance ensures predictable impedance and phase matching for phased array and beamforming networks.


    Temperature Stable: Low thermal coefficient of Dk (12 ppm/°C) maintains consistent performance across operating temperature ranges.


    Copper-Matched CTE: In-plane expansion coefficient matched to copper – excellent dimensional stability for temperature-sensitive applications.


    Low Out-Gassing: Ideal for space applications, satellite communications, and vacuum environments.


    Immersion Silver Finish: Provides a flat, solderable, low-loss surface with excellent conductivity and RF transparency. No solder mask or silkscreen eliminates dielectric interference on RF traces.


    Multi-Layer Ready: Excellent mechanical and electrical properties support reliable multi-layer board constructions.


    Quality Assurance


    100% electrical testing prior to shipment


    IPC-Class-2 compliance


    Full Gerber RS-274-X acceptance


    ISO 9001 certified production


    Typical Applications

    Phased Array Antennas (military, commercial, 5G)

    Ground-Based & Airborne Radar Systems

    Global Positioning System (GPS) Antennas

    Power Backplanes (high-frequency, low-loss)

    Commercial Airline Collision Avoidance Systems (TCAS)

    Beam Forming Networks

    Satellite Communication Payloads

    Space-Grade RF Electronics


    Ordering Information

    Submit your Gerber RS-274-X files and fabrication drawings. We support prototype to volume production with global shipping.


    Contact us for:

    Impedance control reports

    Phase matching verification

    Out-gassing test data (for space applications)

    Volume pricing and lead times


    Quality Custom engineered design 2-Layer RT/duroid 6002 High-Frequency PCB – 30mil (0.8mm) with Immersion Silver Finish for sale
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