F4BME275 High-Frequency Copper Clad Laminate Description
The F4BME275 is a high-performance, glass fiber-reinforced PTFE (Polytetrafluoroethylene) copper clad laminate designed for
advanced microwave and RF applications where a moderately higher
dielectric constant is required for circuit miniaturization,
alongside excellent signal integrity and reliability. As part of
the enhanced "E" series from Taizhou Wangling Insulation Material
Factory, this material is specifically engineered with low-profile
copper foil to meet critical Passive Intermodulation (PIM)
performance standards.
Core Technology and Composition
The substrate is manufactured using a controlled formulation of
woven glass fiber cloth and PTFE resin. The elevated glass fiber
content, relative to lower-Dk variants in the series, provides
improved dimensional stability and a higher dielectric constant.
The defining feature of the F4BME series is the lamination with
reverse-treated foil (RTF) copper, which is essential for achieving
superior PIM characteristics (≤-159 dBc), enabling the fabrication
of precise, high-density circuits, and minimizing signal loss at
high frequencies.
F4BME275 Data Sheet
| Product Technical Parameters | Product Model & Data Sheet |
| Product Features | Test Conditions | Unit | F4BME217 | F4BME220 | F4BME233 | F4BME245 | F4BME255 | F4BME265 | F4BME275 | F4BME294 | F4BME300 |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | 2.2 | 2.33 | 2.45 | 2.55 | 2.65 | 2.75 | 2.94 | 3.0 |
| Dielectric Constant Tolerance | / | / | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.05 | ±0.05 | ±0.05 | ±0.06 | ±0.06 |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | 0.001 | 0.0011 | 0.0012 | 0.0013 | 0.0013 | 0.0015 | 0.0016 | 0.0017 |
| 20GHz | / | 0.0014 | 0.0014 | 0.0015 | 0.0017 | 0.0018 | 0.0019 | 0.0021 | 0.0023 | 0.0025 |
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | -142 | -130 | -120 | -110 | -100 | -92 | -85 | -80 |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 | >1.8 |
| 1 OZ F4BME | N/mm | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 | >1.6 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 | ≥6×10^6 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 | ≥1×10^6 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | >23 | >23 | >25 | >25 | >25 | >28 | >30 | >30 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | >30 | >32 | >32 | >34 | >34 | >35 | >36 | >36 |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 2,534 | 2,534 | 2,230 | 2,025 | 1,621 | 1,417 | 1,416 | 1,215 | 1,215 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | 240 | 205 | 187 | 173 | 142 | 112 | 98 | 95 |
| Thermal Stress | 260℃, 10s,3 times | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 | ≤0.08 |
| Density | Room Temperature | g/cm3 | 2.17 | 2.18 | 2.20 | 2.22 | 2.25 | 2.25 | 2.28 | 2.29 | 2.29 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | 0.24 | 0.28 | 0.30 | 0.33 | 0.36 | 0.38 | 0.41 | 0.42 |
| PIM | Only applicable to F4BME | dBc | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 | ≤-159 |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Material Composition | / | / | PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated
(RTF) copper foil. |
Key Electrical Specifications
Dielectric Constant (Dk): A nominal value of 2.75 at 10 GHz, with a
controlled tolerance of ±0.05. This value facilitates significant
circuit size reduction compared to lower-Dk materials.
Dissipation Factor (Df): Maintains a low loss tangent of 0.0015 at
10 GHz and 0.0021 at 20 GHz, ensuring good signal efficiency
despite the higher Dk.
Dielectric Constant Temperature Coefficient (TcDk): -92 ppm/°C over
a range of -55°C to +150°C, indicating stable electrical
performance over temperature, with reduced temperature sensitivity
compared to lower-Dk versions.
Standard Product Specifications
Copper Foil: Standard offering is with 1 oz (0.035mm) Reverse Treated Foil (RTF). A 0.5 oz (0.018mm) RTF option is also available.
Standard Thickness: Available in various total (copper+dielectric)
or dielectric-only thicknesses. For the F4BME275 (Dk 2.7-3.0
range), the minimum achievable dielectric core thickness is 0.2mm.
Common thicknesses include 0.508mm, 0.762mm, 1.524mm, etc., with corresponding tolerances (e.g., 1.524mm ±0.06mm).
Standard Panel Sizes: Includes efficient standard sizes such as
460mm x 610mm, 500mm x 600mm, and 914mm x 1220mm. Custom sizes are
available upon request.
Mechanical & Thermal Performance:
Peel Strength: >1.6 N/mm (with 1 oz RTF copper).
Coefficient of Thermal Expansion (CTE): XY-direction: 14-16 ppm/°C;
Z-direction: 112 ppm/°C (-55°C to 288°C). The increased glass
content results in notably better dimensional stability (lower
CTE).
Thermal Conductivity (Z-direction): 0.38 W/(m·K), offering slightly
improved heat dissipation.
Max Operating Temperature: -55°C to +260°C.
Flammability Rating: UL 94 V-0.
Other Critical Properties:
Volume & Surface Resistivity: ≥6x10⁶ MΩ.cm and ≥1x10⁶ MΩ,
respectively.
Moisture Absorption: ≤0.08%.
Thermal Stress Reliability: Passes 3 cycles of 10 seconds at 260°C
solder dip without delamination.
Electrical Strength (Z-direction): >28 kV/mm.
Breakdown Voltage (XY-direction): >35 kV.
Typical Applications
Compact Power Dividers, Couplers, and Hybrids
Miniaturized Filters and Multiplexers
High-Density Interconnect (HDI) for RF Modules
Phased Array Antenna Elements requiring smaller footprints
Components for Satellite and Terrestrial Communication Systems
In summary, the F4BME275 is a high-reliability laminate that
provides a stable dielectric constant of 2.75, low loss, and
guaranteed low PIM performance. Its enhanced dimensional stability
and thermal properties, resulting from a higher glass content, make
it a robust and commercially viable choice for designers of
compact, high-frequency electronic systems.
