Double-Sided Copper Clad Laminate with Rogers RO4350B LoPro

Rogers RO4350B LoPro is an advanced hydrocarbon ceramic laminate with a low-profile reverse-treated copper foil. This innovative material reduces conductor loss, improving insertion loss and signal integrity for high-performance designs. The RO4350B LoPro laminate maintains all the benefits of standard RO4350B materials while offering better electrical and thermal performance. Designed to be fabricated using standard FR-4 processes, it eliminates the need for specialized via preparation methods, such as sodium etching, enabling cost-effective manufacturing.

The double-sided copper clad laminate, made with Rogers RO4350B Low Profile (LoPro) material, is a high-performance solution for RF, microwave, and high-speed digital applications. The 1.6mm finished thickness, combined with a 60.7mil (1.542mm) RO4350B LoPro substrate, ensures excellent signal integrity, low conductor loss, and thermal reliability. Compatible with standard FR-4 fabrication processes, this laminate provides a cost-effective, high-frequency solution without requiring specialized manufacturing techniques.

Key Construction Details

PCB Stackup

The 2-layer rigid PCB stackup features a 60.7mil RO4350B LoPro substrate between two copper layers, optimized for high-frequency signal performance and thermal reliability.

Why Choose Rogers RO4350B LoPro?

• Low Conductor Loss: The low-profile copper ensures minimal signal loss for high-frequency designs.
• Cost-Effective Production: Compatible with standard FR-4 processes, reducing fabrication costs.
• Thermal Reliability: With a high decomposition temperature (Td > 390°C), it withstands high-power and high-temperature environments.
• High-Frequency Performance: The low dissipation factor (Df = 0.0037 @ 10GHz) ensures superior signal integrity for applications exceeding 40GHz.

Key Features of Rogers RO4350B LoPro Copper Clad Laminate

1. Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz, ensuring controlled and consistent signal propagation in high-frequency designs.
2. Low Dissipation Factor (Df): 0.0037 at 10GHz, enabling efficient operation with minimal signal loss.
3. Thermal Stability: High thermal decomposition temperature (Td > 390°C) and Tg > 280°C, ensuring reliable performance under extreme heat.
4. Low Z-Axis CTE: 32 ppm/°C, providing excellent dimensional stability and reducing the risk of delamination during thermal cycling.
5. High Thermal Conductivity: 0.69 W/mK, ensuring effective heat dissipation for high-power designs.
6. Reverse-Treated Copper Foil: Minimizes conductor loss for improved signal integrity and insertion loss performance.
7. Lead-Free Process Compatibility: Fully compatible with modern, environmentally friendly manufacturing processes.

Processing Advantages

1. Standard Fabrication Compatibility

The laminate supports FR-4 processes, eliminating the need for specialized fabrication techniques like sodium etching, reducing costs and complexity.

2. High-Temperature Processing

Its high Tg (>280°C) and Td (>390°C) make it compatible with lead-free soldering processes, ensuring thermal reliability.

3. Improved Signal Integrity

The reverse-treated copper minimizes conductor loss, ensuring low insertion loss and stable signal performance at high frequencies.

4. Dimensional Stability

The low Z-axis CTE (32 ppm/°C) ensures reliability during thermal cycling, reducing risks of warping or delamination.

Some Typical Applications
- Digital applications such as servers, routers, and high speed back planes
- Cellular base station antennas and power amplifiers
- LNB’s for direct broadcast satellites
- RF Identification Tags

Conclusion

The double-sided copper clad laminate with Rogers RO4350B LoPro is an advanced material optimized for high-frequency RF, microwave, and digital applications. Its low dissipation factor, thermal reliability, and compatibility with standard FR-4 processes make it a preferred choice for cellular base stations, satellite systems, and high-speed digital circuits. While its higher cost may limit its use in general-purpose designs, its superior performance and environmental compliance ensure reliable operation for next-generation high-frequency systems.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

Main material partners