RT/duroid 6010.2LM Copper Clad Laminate: High-Performance Material
for Precision RF and Microwave Applications
In the world of high-frequency circuit design, where precision and
reliability are paramount, RT/duroid 6010.2LM copper clad laminate
stands out as a premium solution. Designed for microwave and RF
applications, this laminate offers exceptional high dielectric
constant (Dk = 10.2 ± 0.25), low-loss performance, and superior
thermal stability, making it the go-to choice for professional
designers and purchasing agents seeking to optimize their projects.
Why Choose RT/duroid 6010.2LM?
Engineered with ceramic-PTFE composites, RT/duroid 6010.2LM
laminates are ideal for compact circuit designs operating at X-band
frequencies or below. This material delivers repeatable electrical
performance, low dissipation loss, and reliable plated-through
holes (PTH), even in extreme environments. Whether you're designing
radar systems, patch antennas, or satellite communication systems,
RT/duroid 6010.2LM ensures unmatched performance and reliability.
Key Construction Details
| Parameter | Specification |
| Base Material | RT/duroid 6010.2LM |
| Layer Count | 2 Layers |
| Board Dimensions | 45.4mm x 31.8mm ± 0.15mm |
| Finished Thickness | 2.0mm |
| Copper Thickness | 1oz (35μm) on both layers |
| Dielectric Thickness | 1.905mm (75mil) |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.30mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Silver |
| Solder Mask | None (Top and Bottom) |
| Silkscreen | Top: White, Bottom: None |
| Electrical Testing | 100% tested prior to shipment |
Features of RT/duroid 6010.2LM
RT/duroid 6010.2LM laminates are packed with features that make
them the preferred choice for high-frequency circuit designers:
High Dielectric Constant (Dk): 10.2 ± 0.25 at 10GHz, enabling
circuit size reduction and high component density.
Low Dissipation Factor (Df): 0.0023 at 10GHz, delivering low-loss
performance for efficient signal transmission.
Thermal Stability: High Decomposition Temperature (Td) of 500°C,
ensuring reliability in high-power and high-temperature
applications.
Moisture Absorption: 0.01%, ensuring consistent performance even in
humid environments.
Low Z-Axis Expansion: 47 ppm/°C, providing reliable plated-through
holes (PTH) in multi-layer boards.
Thermal Conductivity: 0.86 W/mK, ensuring effective heat
dissipation in high-power designs.
Flammability Rating: UL 94-V0, ensuring safety and compliance with
industry standards.
Conclusion
The RT/duroid 6010.2LM copper clad laminate is a high-performance,
low-loss material designed for advanced RF and microwave
applications. Its high dielectric constant, low dissipation factor,
and thermal stability make it the ideal solution for professional
designers aiming to create reliable, compact, and efficient
high-frequency circuits.
Whether you're designing patch antennas, radar systems, or
satellite communications, RT/duroid 6010.2LM provides the precision
and reliability you need to succeed in today's competitive market.
Contact us today to learn more about how RT/duroid 6010.2LM can
elevate your next project!
