Double-Sided Copper Clad Laminate with Rogers RT/duroid 5880
The double-sided copper clad laminate designed with Rogers
RT/duroid 5880 material is a high-performance solution for
microwave, millimeter-wave, and high-frequency applications. With a
finished thickness of 1.6mm, 62mil RT/duroid 5880 substrate, and
1oz copper layers, this laminate provides exceptional dielectric
constant uniformity, low electrical loss, and thermal reliability.
It is widely used in applications where high frequency stability
and low moisture absorption are critical.
Key Construction Details
| Parameter | Specification |
| Base Material | Rogers RT/duroid 5880 |
| Layer Count | 2 Layers |
| Board Dimensions | 90mm x 90mm ± 0.15mm |
| Finished Thickness | 1.6mm |
| Copper Thickness | 1oz (35μm) on both layers |
| Dielectric Thickness | 62mil (1.575mm) |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.30mm |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Solder Mask | None (Top and Bottom) |
| Silkscreen | None (Top and Bottom) |
| Thermal Decomposition (Td) | 500°C |
| Electrical Testing | 100% tested prior to shipment |
Rogers RT/duroid 5880 laminates are distinguished by their uniform
electrical properties, low dissipation factor (Df = 0.0009 @
10GHz), and low moisture absorption (0.02%), making them ideal for
high-frequency and high-precision designs.
PCB Stackup
The 2-layer rigid PCB stackup features a 62mil RT/duroid 5880
substrate, optimized for ultra-low dielectric loss and stable
performance across high frequencies.
Introduction to Rogers RT/duroid 5880
Rogers RT/duroid 5880 is a glass microfiber-reinforced PTFE
laminate designed for stripline and microstrip circuits in
high-frequency applications. Its randomly oriented glass
microfibers ensure exceptional dielectric constant uniformity,
making it suitable for Ku-band frequencies and above. The
material’s low dissipation factor enables optimal signal integrity,
while its resistance to solvents and reagents ensures compatibility
with common etching and plating processes.
Why Choose Rogers RT/duroid 5880?
Exceptional Electrical Properties: Uniform dielectric constant (Dk
= 2.2) and ultra-low loss (Df = 0.0009) ensure stable
high-frequency operation.
Thermal Reliability: With a high decomposition temperature (Td =
500°C) and isotropic thermal expansion, the material performs well
in extreme environments.
Moisture Resistance: The low moisture absorption (0.02%) ensures
stable performance in high-humidity environments.
Ease of Processing: The material can be easily cut, sheared, or
machined, making it highly versatile for complex designs.
Key Features of Rogers RT/duroid 5880 Copper Clad Laminate
Dielectric Constant (Dk): 2.2 ± 0.02 at 10GHz, providing consistent
and uniform electrical properties.
Low Dissipation Factor (Df): 0.0009 at 10GHz, enabling minimal
signal loss and high efficiency in RF circuits.
Thermal Stability: High decomposition temperature (Td = 500°C)
ensures performance in harsh thermal conditions.
Low Moisture Absorption: 0.02%, making it ideal for use in
high-humidity environments without compromising electrical
performance.
Applications of Rogers RT/duroid 5880 Copper Clad Laminate
Commercial Airline Broadband Antennas
Microstrip and Stripline Circuits
Millimeter-Wave Applications
Radar Systems
Guidance Systems
Point-to-Point Digital Radio Antennas
Conclusion
The double-sided copper clad laminate with Rogers RT/duroid 5880 is
a high-performance material optimized for microwave,
millimeter-wave, and high-frequency RF applications. Its low
dissipation factor, uniform dielectric properties, and thermal
stability make it ideal for precision circuits in radar, guidance
systems, point-to-point antennas, and aerospace applications. While
its higher material cost might limit use in general-purpose
designs, its superior performance and environmental compliance
ensure reliable operation for next-generation electronic systems.
