Double-Sided Copper Clad Laminate with Rogers RO4360G2

The double-sided copper clad laminate built with Rogers RO4360G2 is designed for high-frequency RF and microwave applications. With a 32mil (0.813mm) RO4360G2 substrate, finished thickness of 0.9mm, and 1oz copper layers, this laminate provides high dielectric performance, low loss, and thermal reliability. It is compatible with FR-4 processing techniques, making it a cost-effective and efficient solution for both single- and multi-layer circuit designs.

Key Construction Details

Rogers RO4360G2 delivers high dielectric constant (Dk = 6.15 ± 0.15 @ 10GHz) and low dissipation factor (Df = 0.0038 @ 10GHz), ensuring superior signal integrity and high-frequency stability.

PCB Stackup

The 2-layer rigid PCB stackup is designed for high-frequency and high-power performance with a 32mil (0.813mm) RO4360G2 substrate sandwiched between two copper layers.

Introduction to Rogers RO4360G2

Rogers RO4360G2 is a high-performance thermoset laminate combining glass-reinforced hydrocarbon ceramics with FR-4 process compatibility. It offers high dielectric constant (Dk) and low loss properties, making it ideal for high-frequency circuits. The material is rigid and suitable for plated through-hole designs while maintaining low material and fabrication costs. Its lead-free compatibility and environmental compliance make it well-suited for modern manufacturing standards.

Why Choose Rogers RO4360G2?

1. High Dielectric Constant (Dk): At 6.15 ± 0.15 @ 10GHz, this material enables compact, high-frequency designs with improved circuit density.
2. Low Loss Performance: With a Df of 0.0038 @ 10GHz, it supports efficient signal transmission and minimal insertion loss.
3. Cost-Effective Processing: Compatible with standard FR-4 techniques, reducing fabrication costs without sacrificing performance.
4. Thermal Reliability: Features a high decomposition temperature (Td > 407°C) and thermal conductivity of 0.75W/mK, ensuring durability in high-power applications.

Key Features of Rogers RO4360G2 Copper Clad Laminate

• Dielectric Constant (Dk): 6.15 ± 0.15 at 10GHz, optimized for miniaturized, high-density circuit designs.
• Low Dissipation Factor (Df): 0.0038 at 10GHz, ensuring minimal signal loss for high-frequency applications.
• Thermal Stability: High Td (>407°C) and Tg >280°C, ensuring reliable performance in harsh environments.
• Low Z-Axis CTE: 28 ppm/°C, providing dimensional stability and reducing the risk of delamination during thermal cycling.
• High Thermal Conductivity: 0.75 W/mK, offering excellent heat dissipation for high-power designs.
• Plated Through-Hole Reliability: Enhanced rigidity ensures robust PTH designs with improved reliability.
• Lead-Free Process Compatibility: Fully compliant with modern, environmentally friendly manufacturing processes.
• UL 94-V0 Flammability Rating: Meets strict safety and environmental standards.

Conclusion

The double-sided copper clad laminate with Rogers RO4360G2 is a high-performance material optimized for high-frequency RF and microwave designs. Its high dielectric constant, low loss, and superior thermal performance make it ideal for base station amplifiers, small cell transceivers, and high-power RF circuits. While its higher cost may limit its use in general-purpose designs, its outstanding signal integrity and environmental compliance ensure reliable operation for next-generation electronic systems.

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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