TMM10i 2-Layer PCB: 30mil with Immersion Tin Finish
The TMM10i 2-layer PCB is a high-performance circuit board designed
specifically for RF and microwave applications. Built with Rogers
TMM10i laminates, this PCB offers exceptional dielectric stability,
high mechanical reliability, and ease of processing. The 30mil
TMM10i core ensures a low-loss, high-frequency response, making it
ideal for advanced communication systems like satellite and GPS
antennas. The Immersion Tin surface finish further enhances
solderability and protects copper traces during assembly.
Key Construction Details
Parameter | Specification |
Base Material | Rogers TMM10i |
Layer Count | 2 layers (Double-sided) |
Board Dimensions | 70mm x 75mm (± 0.15mm) |
Minimum Trace/Space | 6/4 mils |
Minimum Hole Size | 0.3mm |
Blind Vias | None |
Finished Thickness | 0.8mm |
Copper Weight | 1oz (35μm) on both layers |
Via Plating Thickness | 20μm |
Surface Finish | Immersion Tin |
Top Silkscreen | None |
Bottom Silkscreen | None |
Top Solder Mask | None |
Bottom Solder Mask | None |
Electrical Testing | 100% tested prior to shipment |
Features of TMM10i Material
- Dielectric Constant (Dk): 9.80 ± 0.245 for stable signal
propagation.
- Dissipation Factor (Df): 0.0020 at 10GHz for low insertion loss.
- Thermal Coefficient of Dk: -43 ppm/°K, maintaining stable
performance across temperature changes.
- CTE (Coefficient of Thermal Expansion): X-axis: 19 ppm/K, Y-axis:
19 ppm/K, Z-axis: 20 ppm/K
- Decomposition Temperature (Td): 425°C for high thermal reliability.
- Thermal Conductivity: 0.76 W/mK for efficient heat dissipation.
- Peel Strength: Excellent adhesion for reliable copper cladding.
Data Sheet of TMM10
Property | TMM10i | Direction | Units | Condition | Test Method |
Dielectric Constant,εProcess | 9.80±0.245 | Z |
| 10 GHz | IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign | 9.9 | - | - | 8GHz to 40 GHz | Differential Phase Length Method |
Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant | -43 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 |
Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 |
Volume Resistivity | 2 x 108 | - | Mohm.cm | - | ASTM D257 |
Surface Resistivity | 4 x 107 | - | Mohm | - | ASTM D257 |
Electrical Strength(dielectric strength) | 267 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 |
Coefficient of Thermal Expansion - x | 19 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y | 19 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z | 20 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity | 0.76 | Z | W/m/K | 80 ℃ | ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress | 5.0 (0.9) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) | - | X,Y | kpsi | A | ASTM D790 |
Flexural Modulus (MD/CMD) | 1.8 | X,Y | Mpsi | A | ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) | 1.27mm (0.050") | 0.16 | - | % | D/24/23 | ASTM D570 |
3.18mm (0.125") | 0.13 |
Specific Gravity | 2.77 | - | - | A | ASTM D792 |
Specific Heat Capacity | 0.72 | - | J/g/K | A | Calculated |
Lead-Free Process Compatible | YES | - | - | - | -
|
Applications of TMM10i PCB
RF and Microwave Circuitry
Power Amplifiers and Combiners
Filters and Couplers
Satellite Communication Systems
Global Positioning System (GPS) Antennas
Patch Antennas
Dielectric Polarizers and Lenses
Chip Testers
Why Choose TMM10i PCB?
Exceptional Dielectric Stability: With a Dk of 9.80 ± 0.245, TMM10i
ensures precise signal integrity at high frequencies.
Low Signal Loss: The Df of 0.0020 makes it suitable for high-power
RF applications.
Thermal and Mechanical Reliability: The high decomposition
temperature and CTE matched to copper ensure performance in
demanding environments.
Ease of Manufacturing: The material supports standard PCB
processing, reducing fabrication complexity and costs.
Environmentally Friendly: Lead-free and RoHS-compliant, ensuring
sustainability and compliance with modern standards.
The TMM10i 2-layer PCB is the perfect choice for RF engineers and
designers seeking a high-performance, high-reliability solution for
microwave and communication systems.
