Copper Coin Embedded 6-Layer Hybrid PCB: M6 and IT180 for
High-Performance Applications
At the forefront of advanced PCB technology, our Copper Coin
Embedded 6-Layer Hybrid PCB is designed to meet the rigorous
demands of high-speed communication, automotive electronics, and
aerospace applications. Utilizing a hybrid construction of M6
high-speed material and IT180 High Tg FR-4, this PCB delivers
exceptional thermal performance, signal integrity, and mechanical
reliability.
Whether it’s 5G base stations, millimeter-wave radar systems, or
advanced aerospace electronics, this PCB is engineered to excel in
high-frequency and high-power environments. Here’s an in-depth look
at its construction, features, and applications.
Key Construction Details
| Parameter | Specification |
| Base Material | M6 High-Speed Material + IT180 High Tg FR-4 |
| Layer Count | 6 layers |
| Board Dimensions | 100mm x 50mm |
| Minimum Trace/Space | 4/5 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Thickness | 1.0mm |
| Copper Weight | 1oz/0.5oz inner layers, 1oz outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top/Bottom Silkscreen | White |
| Top/Bottom Solder Mask | Green |
| Special Features | Copper Coin Embedded, Resin-Filled and Capped Vias |
This IPC-Class-2 compliant PCB undergoes a 100% electrical test
prior to shipment, ensuring reliability and quality.
PCB Stackup
| Layer | Material | Thickness | Dielectric Constant (Dk) |
| Copper Layer Top | Copper (1oz) | 35μm | - |
| Dielectric Layer | R5775G (M6 Core) | 0.25mm | 3.61 |
| Copper Layer Inn1 | Copper (0.5oz) | 18μm | - |
| Prepreg Layer | 1080 (64%) x 2 | 0.14mm | 3.72 |
| Copper Layer Inn2 | Copper (1oz) | 35μm | - |
| Dielectric Layer | IT180 Core | 0.10mm | 4.17 |
| Copper Layer Inn3 | Copper (1oz) | 35μm | - |
| Prepreg Layer | 1080 (64%) x 2 | 0.14mm | 3.72 |
| Copper Layer Inn4 | Copper (0.5oz) | 18μm | - |
| Dielectric Layer | IT180 Core | 0.10mm | 4.17 |
| Copper Layer Bottom | Copper (1oz) | 35μm | - |
Features of the Copper Coin Embedded PCB
1. Copper Coin Embedded for Thermal Management
A copper coin is embedded in the center of the PCB to absorb and
dissipate heat efficiently. This feature is critical for high-power
applications such as automotive radar and 5G base stations, where
thermal management is crucial to ensure long-term reliability.
2. High-Speed M6 Material
Dielectric Constant (Dk): 3.4 at 1GHz and 3.34 at 13GHz for low
signal distortion.
Dissipation Factor (Df): Extremely low at 0.002 (1GHz) and 0.0037
(13GHz), ensuring minimal signal loss.
High Thermal Decomposition Temperature (Td): 410°C for stability
under extreme heat.
Compatibility with FR-4 Processing: Simplifies manufacturing and
reduces costs.
3. Thermal and Mechanical Stability from IT180
Tg >185°C for thermal stability.
Dielectric Constant (Dk): 4.17, ideal for mixed-signal designs.
CTE (Coefficient of Thermal Expansion): Z-axis CTE of 45ppm/°C
ensures plated-through hole reliability.
4. Resin-Filled and Capped Vias
All vias are resin-filled and capped, improving structural
integrity and preventing solder wicking, making the PCB suitable
for high-density interconnects.
Applications of the Copper Coin Embedded PCB
Millimeter-wave antennas and RF front-ends for AAUs (Active Antenna
Units).
77GHz millimeter-wave radar and ADAS (Advanced Driver Assistance
Systems).
High-speed data transmission for routers, servers, and switches.
High-reliability circuits for avionics and radar systems.
Why Choose This PCB?
Our Copper Coin Embedded 6-Layer PCB is the ultimate solution for
designers looking to balance high performance, thermal efficiency,
and cost-effectiveness.
Here’s why it stands out:
Exceptional Thermal Management: The copper coin ensures heat
dissipation in high-power circuits.
High-Frequency Performance: M6 material minimizes signal loss,
making it perfect for RF and millimeter-wave designs.
Durability: Resin-filled vias and hybrid stackup enhance
reliability in harsh environments.
Cost-Effective Manufacturing: Compatible with standard FR-4
processes, reducing production costs.
Conclusion
The Copper Coin Embedded 6-Layer Hybrid PCB combines the best of M6
high-speed material and IT180 High Tg FR-4, delivering unmatched
performance, thermal stability, and reliability. Whether you're
designing for 5G infrastructure, automotive radar, or aerospace
systems, this PCB is built to meet your most demanding
requirements.
Ready to take your designs to the next level? Contact us today to
learn more about how this innovative PCB can power your
next-generation applications!
