RO4350B PCB: 6-Layer, 1.6mm Thickness, ENIG Finish with Blind Vias
(All PCBs are custom-manufactured. Reference images and parameters
may vary based on your design requirements.)
Overview of RO4350B 6-Layer PCB
The RO4350B PCB is a high-performance 6-layer rigid PCB designed
for RF, microwave, and high-frequency applications, featuring blind
vias for efficient multilayer connectivity. With a finished
thickness of 1.6mm and Electroless Nickel Immersion Gold (ENIG)
surface finish, this PCB combines low dielectric loss, excellent
dimensional stability, and cost-effective manufacturability.
The Rogers RO4350B laminates provide dielectric constant (Dk)
control of 3.48 ± 0.05 at 10GHz, making it suitable for multi-layer
board (MLB) constructions and high-power RF applications. This PCB
is widely used in cellular base stations, automotive radar, and
direct broadcast satellite systems.
PCB Construction Details
The following table outlines the construction details of the
RO4350B PCB:
| Parameter | Specification |
| Base Material | Rogers RO4350B |
| Layer Count | 6 layers |
| Board Dimensions | 110mm x 80mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | L1-L4, L5-L6 |
| Finished Thickness | 1.6mm |
| Copper Weight | 1oz (1.4 mils) inner and outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Electrical Testing | 100% tested before shipment |
Introduction to RO4350B Material
The Rogers RO4350B laminates are woven glass-reinforced
hydrocarbon/ceramic composites, combining the electrical
performance of PTFE with the manufacturability of FR-4 materials.
These laminates offer exceptional dimensional stability, low loss,
and thermal reliability, making them ideal for high-power RF and
microwave applications.
Key Features of RO4350B
- Dielectric Constant (Dk): 3.48 ± 0.05 at 10GHz / 23°C.
- Dissipation Factor: 0.0037 at 10GHz.
- Thermal Conductivity: 0.69 W/m/°K for efficient heat dissipation.
- CTE (Coefficient of Thermal Expansion): X-axis: 10 ppm/°C. Y-axis:
12 ppm/°C. Z-axis: 32 ppm/°C.
- High Tg: >280°C for thermal stability during processing and
operation.
- Moisture Absorption: Extremely low at 0.06%.
- UL 94 V-0 Certified: Ensures flame resistance for safety-critical
applications.
Benefits of RO4350B
- Cost-Effective: Processes like FR-4 at a fraction of the cost of
PTFE laminates.
- Ideal for Multi-Layer Boards: Tight Dk control and low Z-axis CTE
ensure reliable multilayer designs.
- Dimensional Stability: Maintains structural integrity under thermal
and mechanical stress.
- Excellent Signal Performance: Low dissipation factor and dielectric
loss for high-frequency designs.
Applications
- Cellular Base Station Antennas
- Power Amplifiers
- RF Identification Tags (RFID)
- Automotive Radar and Sensors
- Direct Broadcast Satellites (DBS)
- Microwave Components
- LMDS and Wireless Broadband
Conclusion
The RO4350B 6-layer PCB is a high-performance solution for RF and
microwave applications, offering low dielectric loss, thermal
reliability, and dimensional stability. With its blind vias, 1.6mm
finished thickness, and ENIG surface finish, this PCB is tailored
for complex, high-frequency, multilayer designs such as cellular
base station antennas, automotive radar systems, and direct
broadcast satellites.
Compliant with IPC-Class-2 standards and available worldwide, the
RO4350B PCB is the
