RO3206 PCB: 2-Layer, 25mil Core, 0.75mm Thickness with Immersion
Gold Finish
(All PCBs are custom-manufactured. Reference images and parameters
may vary based on your design requirements.)
Overview of RO3206 2-Layer PCB
The RO3206 PCB is a high-performance 2-layer rigid PCB designed for
RF, microwave, and high-frequency applications. Built with Rogers
RO3206 laminates, this PCB features a 25mil (0.635mm) core and a
finished thickness of 0.75mm, ensuring exceptional electrical
performance, mechanical stability, and low dielectric loss. With a
dielectric constant (Dk) of 6.15 ± 0.15 at 10 GHz and a dissipation
factor of 0.0027, the RO3206 PCB is an ideal choice for wireless
communication systems and automotive radar applications.
The blue solder mask, white silkscreen on the top layer, and
Immersion Gold (ENIG) surface finish enhance the board's
durability, aesthetics, and solderability, making it suitable for
high-precision and high-frequency designs.
PCB Construction Details
| Parameter | Specification |
| Base Material | Rogers RO3206 |
| Layer Count | 2 layers |
| Board Dimensions | 63mm x 45mm |
| Minimum Trace/Space | 4/4 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | None |
| Finished Thickness | 0.75mm |
| Copper Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold (ENIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Blue |
| Bottom Solder Mask | None |
| Electrical Testing | 100% tested before shipment |
PCB Stackup
| Layer | Material | Thickness |
| Copper Layer 1 | Copper (1oz) | 35μm |
| Dielectric Layer | Rogers RO3206 Core | 0.635mm (25mil) |
| Copper Layer 2 | Copper (1oz) | 35μm |
Introduction to RO3206 Material
The Rogers RO3206 laminates are ceramic-filled, woven
fiberglass-reinforced PTFE composites, offering superior electrical
and mechanical stability. These laminates are widely used in
high-frequency circuits due to their low dielectric loss, high
thermal conductivity, and excellent dimensional stability. The
material's characteristics make it perfect for complex multilayer
structures and surface-mounted assemblies.
Key Features of RO3206
- Dielectric Constant (Dk): 6.15 ± 0.15 at 10 GHz / 23°C.
- Dissipation Factor: Low at 0.0027 at 10 GHz.
- Thermal Conductivity: 0.67 W/mK for superior heat dissipation.
- CTE (Coefficient of Thermal Expansion): X-axis: 13 ppm/°C. Y-axis:
13 ppm/°C. Z-axis: 34 ppm/°C.
- Moisture Absorption: Very low at <0.1%.
- Peel Strength: Strong copper adhesion at 10.7 lbs/in.
Benefits of RO3206
- Woven Glass Reinforcement: Improves rigidity for easier handling.
- Uniform Electrical and Mechanical Properties: Ensures consistent
performance in high-frequency designs.
- Low Dielectric Loss: Ideal for RF and microwave applications.
- Dimensional Stability: High production yields and reliability.
- Cost-Effective: Economical for volume manufacturing.
- Surface Smoothness: Enables finer line etching tolerances.
Applications
Automotive Collision Avoidance Systems
Global Positioning Antennas
Wireless Telecommunications Systems
Microstrip Patch Antennas
Direct Broadcast Satellites
Datalink on Cable Systems
Remote Meter Readers
Power Backplanes
LMDS and Wireless Broadband
Conclusion
The RO3206 2-layer PCB is a high-performance solution for RF,
microwave, and high-frequency designs, offering low dielectric
loss, thermal stability, and dimensional accuracy. With its 25mil
RO3206 core, blue solder mask, and Immersion Gold finish, this PCB
delivers consistent performance for demanding applications such as
automotive radar systems, wireless telecommunications, and
satellite communications.
Compliant with IPC-Class-2 standards and available worldwide, the
RO3206 PCB is the perfect choice for engineers seeking
cost-effective, high-frequency PCB solutions.
