What circuit boards do we do? (51)
TMS-DS3 High Frequency PCB
Introduction
TSM-DS3 is a dimensionally stable laminate with exceptional
low-loss properties. Its thermal stability makes it an
industry-leading choice, with a dissipation factor (DF) of 0.0011
at 10 GHz. This laminate offers the reliability and consistency of
top-quality fiberglass reinforced epoxies.
Features
TSM-DS3 stands out as a ceramic-filled reinforced material with a
minimal fiberglass content of approximately 5%. This composition
allows it to compete with epoxies in the fabrication of complex
multilayers, even in large formats. It was specifically developed
for high-power applications, where efficient heat dissipation is
crucial (thermal conductivity: 0.65 W/m*K). TSM-DS3 effectively
conducts heat away from other heat sources in a PCB design.
Furthermore, TSM-DS3 exhibits very low coefficients of thermal
expansion, making it suitable for demanding thermal cycling
requirements.
PCB Capability
Our capabilities include single-sided, double-sided, multi-layer
PCBs, as well as hybrid PCBs. You have the flexibility to choose
the appropriate copper weight for your requirements, whether it's
1oz (35µm) or 2oz (70µm).
Additionally, we can accommodate various dielectric thicknesses,
ranging from 5mil to 90mil, including options such as 10mil, 20mil,
30mil, 60mil and more.
Our capabilities extend to dimension sizes up to 400mm X 500mm,
ensuring we can handle projects of different scales. To suit your
aesthetic and functional preferences, we offer a diverse range of
solder mask colors, including green, black, blue, yellow, red, and
more.
Moreover, we provide various surface finish options including
immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP,
bare copper, and pure gold etc.
Applications
TSM-DS3 PCB covers a multitude of applications, including couplers,
phased array antennas, radar manifolds, mmWave antennas, oil
drilling, semiconductor, and automated test equipment (ATE)
testing.
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