F4BTMS265 High Frequency PCB 0.8mm Substrates 1oz Copper With Immersion Gold and Black Solder Mask
(PCB's are custom-made products, the picture and parameters shown
are just for reference)
Brief Introduction
This is a type of double sided PCB with 2 layers of copper. It has
only surface mount components. The PCB measures 120mm x 65mm with 1
piece up in panel. It starts 17um (0.5 oz) copper with plate on
both the top layer and bottom layer. The core of F4BTMS265
(0.762mm) is in the middle. The surface finish is immersion gold,
and the solder mask on the top layer is black.
PCB Specifications
| PCB SIZE | 120 x 65mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| F4BTMS265 -0.762mm |
| copper ------- 17um(0.5 oz) + plate BOT Layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5 mil / 5 mil |
| Minimum / Maximum Holes: | 0.35 mm / 0.6 mm |
| Number of Different Holes: | 6 |
| Number of Drill Holes: | 81 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 1 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | F4BTMS265 Dk2.65 |
| Final foil external: | 1oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.8 mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | Top, Black |
| Solder Mask Color: | no |
| Solder Mask Type: | no |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top |
| Colour of Component Legend | NO |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.35mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
F4BTMS High Frequency Material
The F4BTMS series is an upgraded version of the F4BTM series.
Building upon its foundation, significant technological
advancements have been made in material formulation and
manufacturing processes. The material now incorporates a large
amount of ceramics and utilizes ultra-thin and ultra-fine
fiberglass cloth reinforcement. These enhancements have greatly
improved the material's performance, resulting in a wider range of
dielectric constants. It is a high-reliability material suitable
for aerospace applications, capable of replacing similar foreign
products.
By incorporating a small amount of ultra-thin and ultra-fine
fiberglass cloth reinforcement, along with a significant and
uniform mixture of special nanoceramics and polytetrafluoroethylene
resin, the fiberglass effect during the propagation of
electromagnetic waves is minimized, reducing dielectric loss and
enhancing dimensional stability. The material exhibits reduced
anisotropy in the X/Y/Z directions, allowing for higher frequency
usage, increased electrical strength, and improved thermal
conductivity. The material also possesses excellent low coefficient
of thermal expansion and stable dielectric temperature
characteristics.
The F4BTMS series comes standard with RTF low roughness copper
foil, which not only reduces conductor loss but also provides
excellent peel strength. It can be paired with copper-based or
aluminum-based options.
Typical Applications
Aerospace equipment, space, cabin equipment
Microwave, Radio frequency
Radar, military radar
Feed network
Phase-sensitive antenna, phased array antenna
Satellite communications.
Our PCB Capability (F4BTMS)
| PCB Material: | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. |
| Designation (F4BTMS ) | F4BTMS | DK (10GHz) | DF (10 GHz) |
| F4BTMS220 | 2.2±0.02 | 0.0009 |
| F4BTMS233 | 2.33±0.03 | 0.0010 |
| F4BTMS255 | 2.55±0.04 | 0.0012 |
| F4BTMS265 | 2.65±0.04 | 0.0012 |
| F4BTMS294 | 2.94±0.04 | 0.0012 |
| F4BTMS300 | 3.0±0.04 | 0.0013 |
| F4BTMS350 | 3.5±0.05 | 0.0016 |
| F4BTMS430 | 4.3±0.09 | 0.0015 |
| F4BTMS450 | 4.5±0.09 | 0.0015 |
| F4BTMS615 | 6.15±0.12 | 0.0020 |
| F4BTMS1000 | 10.2±0.2 | 0.0020 |
| Layer count: | Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness | 0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil),
0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil),
1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil),
2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil),
5.08mm(200mil), 6.35mm(250mil) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure
gold, ENEPIG etc.. |
Data Sheet (F4BTMS)
| Product Technical Parameters | Product Models & Data Sheet |
| Product Features | Test Conditions | Unit | F4BTMS220 | F4BTMS233 | F4BTMS255 | F4BTMS265 | F4BTMS294 | F4BTMS300 | F4BTMS350 | F4BTMS430 | F4BTMS450 | F4BTMS615 | F4BTMS1000 |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.00 | 3.50 | 4.30 | 4.50 | 6.15 | 10.20 |
| Dielectric Constant Tolerance | / | / | ±0.02 | ±0.03 | ±0.04 | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.09 | ±0.09 | ±0.12 | ±0.2 |
| Dielectric Constant (Design) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.0 | 3.50 | 4.3 | 4.5 | 6.15 | 10.2 |
| Loss Tangent (Typical) | 10GHz | / | 0.0009 | 0.0010 | 0.0012 | 0.0012 | 0.0012 | 0.0013 | 0.0016 | 0.0015 | 0.0015 | 0.0020 | 0.0020 |
| 20GHz | / | 0.0010 | 0.0011 | 0.0013 | 0.0014 | 0.0014 | 0.0015 | 0.0019 | 0.0019 | 0.0019 | 0.0023 | 0.0023 |
| 40GHz | / | 0.0013 | 0.0015 | 0.0016 | 0.0018 | 0.0018 | 0.0019 | 0.0024 | 0.0024 | 0.0024 | / | / |
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -130 | -122 | -92 | -88 | -20 | -20 | -39 | -60 | -58 | -96 | -320 |
| Peel Strength | 1 OZ RTF copper | N/mm | >2.4 | >2.4 | >1.8 | >1.8 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >34 | >40 | >40 | >42 | >44 | >45 | >48 | >23 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >35 | >38 | >40 | >42 | >48 | >52 | >55 | >52 | >54 | >55 | >42 |
| Coefficientof Thermal Expansion (X, Y direction) | -55 º~288ºC | ppm/ºC | 40, 50 | 35, 40 | 15, 20 | 15, 20 | 10, 12 | 10, 11 | 10, 12 | 13, 12 | 12, 12 | 10, 12 | 16, 18 |
| Coefficientof Thermal Expansion (Z direction) | -55 º~288ºC | ppm/ºC | 290 | 220 | 80 | 72 | 22 | 22 | 20 | 47 | 45 | 40 | 32 |
| Thermal Stress | 260℃, 10s,3 times | / | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | 0.02 | 0.02 | 0.025 | 0.025 | 0.02 | 0.025 | 0.03 | 0.08 | 0.08 | 0.1 | 0.03 |
| Density | Room Temperature | g/cm3 | 2.18 | 2.22 | 2.26 | 2.26 | 2.25 | 2.28 | 2.3 | 2.51 | 2.53 | 2.75 | 3.2 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.26 | 0.28 | 0.31 | 0.36 | 0.58 | 0.58 | 0.6 | 0.63 | 0.64 | 0.67 | 0.81 |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Material Composition | / | / | PTFE,Ultra-thin and ultra-fine (quartz) fiberglass. | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. |
