F4BTMS1000 High Frequency PCB High DK10.2 PTFE 3.2mm Substrates with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown
are just for reference)
Brief Introduction
This Double-sided PCB features circuitry on both the top and bottom
layers, each with a copper weight of 2oz. The middle layer consists
of an F4BTMS1000 core, measuring 3.175 mm in thickness. The PCB
size is 215mm x 145mm, with a single unit in the panel. It is
equipped with surface mount components and does not include any
through-hole components. The surface finish is Immersion Gold, and
a black solder mask is applied to the top side of the PCB. Prior to
shipment, a comprehensive 100% Electrical Test is carried out to
ensure functionality and uphold quality standards.
Here are the details in table below.
| PCB SIZE | 215 x 145mm=1PCS |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 70 um(1 oz+plate) TOP layer |
| F4BTMS1000 -3.175 mm |
| copper ------- 70 um(1 oz + plate) BOT Layer |
| TECHNOLOGY | |
| Minimum Trace and Space: | 12 mil / 12 mil |
| Minimum / Maximum Holes: | 0.6 mm / 3.0 mm |
| Number of Different Holes: | 6 |
| Number of Drill Holes: | 36 |
| Number of Milled Slots: | 1 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | F4BTMS1000 Dk10.2 |
| Final foil external: | 2oz |
| Final foil internal: | N/A |
| Final height of PCB: | 3.2 mm ±10% |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold |
| Solder Mask Apply To: | Top, Black |
| Solder Mask Color: | no |
| Solder Mask Type: | no |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.6mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
F4BTMS High Frequency Laminate
The F4BTMS series is an upgraded version of the F4BTM series.
Building upon its foundation, significant technological
advancements have been made in material formulation and
manufacturing processes. The material now incorporates a large
amount of ceramics and utilizes ultra-thin and ultra-fine
fiberglass cloth reinforcement. These enhancements have greatly
improved the material's performance, resulting in a wider range of
dielectric constants. It is a high-reliability material suitable
for aerospace applications, capable of replacing similar foreign
products.
By incorporating a small amount of ultra-thin and ultra-fine
fiberglass cloth reinforcement, along with a significant and
uniform mixture of special nanoceramics and polytetrafluoroethylene
resin, the fiberglass effect during the propagation of
electromagnetic waves is minimized, reducing dielectric loss and
enhancing dimensional stability. The material exhibits reduced
anisotropy in the X/Y/Z directions, allowing for higher frequency
usage, increased electrical strength, and improved thermal
conductivity. The material also possesses excellent low coefficient
of thermal expansion and stable dielectric temperature
characteristics.
The F4BTMS series comes standard with RTF low roughness copper
foil, which not only reduces conductor loss but also provides
excellent peel strength. It can be paired with copper-based or
aluminum-based options.
Features
◆ Small dielectric constant tolerance and good consistency between
batches;
◆ Ultra-low dielectric loss;
◆ It has stable dielectric constant and low loss value when the
operating frequency is within 40G, which can meet the
phase-sensitive application;
◆ The change coefficient of dielectric constant and dielectric loss
with temperature is excellent, maintaining excellent frequency
stability and phase stability between - 55 ℃ and 150 ℃;
◆ Excellent radiation resistance. After the dose irradiation
treatment, it still maintains stable dielectric and physical
properties.
◆ Low exhaust performance, tested according to the standard method
of material volatilization performance under vacuum conditions,
meets the requirements of vacuum exhaust for aerospace;
◆ The thermal expansion coefficient of material in X/Y/Z direction
is small; The dimensional thermal stability and the reliability of
pore copper are guaranteed;
◆ Better thermal conductivity, suitable for high-power
applications.
◆ Excellent dimensional stability;
◆ Low water absorption.
Typical Applications
- Aerospace equipment, space and cabin equipment
- Microwave and RF
- Radar and military radar
- Feed network
- Phase-sensitive antenna and phased array antenna
- Satellite communication, etc
Data Sheet (F4BTMS)
| Product Technical Parameters | Product Models & Data Sheet |
| Product Features | Test Conditions | Unit | F4BTMS220 | F4BTMS233 | F4BTMS255 | F4BTMS265 | F4BTMS294 | F4BTMS300 | F4BTMS350 | F4BTMS430 | F4BTMS450 | F4BTMS615 | F4BTMS1000 |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.00 | 3.50 | 4.30 | 4.50 | 6.15 | 10.20 |
| Dielectric Constant Tolerance | / | / | ±0.02 | ±0.03 | ±0.04 | ±0.04 | ±0.04 | ±0.04 | ±0.05 | ±0.09 | ±0.09 | ±0.12 | ±0.2 |
| Dielectric Constant (Design) | 10GHz | / | 2.2 | 2.33 | 2.55 | 2.65 | 2.94 | 3.0 | 3.50 | 4.3 | 4.5 | 6.15 | 10.2 |
| Loss Tangent (Typical) | 10GHz | / | 0.0009 | 0.0010 | 0.0012 | 0.0012 | 0.0012 | 0.0013 | 0.0016 | 0.0015 | 0.0015 | 0.0020 | 0.0020 |
| 20GHz | / | 0.0010 | 0.0011 | 0.0013 | 0.0014 | 0.0014 | 0.0015 | 0.0019 | 0.0019 | 0.0019 | 0.0023 | 0.0023 |
| 40GHz | / | 0.0013 | 0.0015 | 0.0016 | 0.0018 | 0.0018 | 0.0019 | 0.0024 | 0.0024 | 0.0024 | / | / |
| Dielectric Constant Temperature Coefficient | -55 º~150ºC | PPM/℃ | -130 | -122 | -92 | -88 | -20 | -20 | -39 | -60 | -58 | -96 | -320 |
| Peel Strength | 1 OZ RTF copper | N/mm | >2.4 | >2.4 | >1.8 | >1.8 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 | >1.2 |
| Volume Resistivity | Standard Condition | MΩ.cm | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 | ≥1×10^8 |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >26 | >30 | >32 | >34 | >40 | >40 | >42 | >44 | >45 | >48 | >23 |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >35 | >38 | >40 | >42 | >48 | >52 | >55 | >52 | >54 | >55 | >42 |
| Coefficientof Thermal Expansion (X, Y direction) | -55 º~288ºC | ppm/ºC | 40, 50 | 35, 40 | 15, 20 | 15, 20 | 10, 12 | 10, 11 | 10, 12 | 13, 12 | 12, 12 | 10, 12 | 16, 18 |
| Coefficientof Thermal Expansion (Z direction) | -55 º~288ºC | ppm/ºC | 290 | 220 | 80 | 72 | 22 | 22 | 20 | 47 | 45 | 40 | 32 |
| Thermal Stress | 260℃, 10s,3 times | / | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination | No delamination |
| Water Absorption | 20±2℃, 24 hours | % | 0.02 | 0.02 | 0.025 | 0.025 | 0.02 | 0.025 | 0.03 | 0.08 | 0.08 | 0.1 | 0.03 |
| Density | Room Temperature | g/cm3 | 2.18 | 2.22 | 2.26 | 2.26 | 2.25 | 2.28 | 2.3 | 2.51 | 2.53 | 2.75 | 3.2 |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 | -55～+260 |
| Thermal Conductivity | Z direction | W/(M.K) | 0.26 | 0.28 | 0.31 | 0.36 | 0.58 | 0.58 | 0.6 | 0.63 | 0.64 | 0.67 | 0.81 |
| Flammability | / | UL-94 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 | V-0 |
| Material Composition | / | / | PTFE,Ultra-thin and ultra-fine (quartz) fiberglass. | PTFE,Ultra-thin and ultra-fine fiberglass, ceramics. |
