What circuit boards do we do? (6)
TC350 High Frequency PCB
Introduction
Rogers TC350 laminates are composite substrates of PTFE, highly
thermally conductive ceramic fillers and woven glass reinforcement,
offering outstanding thermal conductivity to enhance heat transfer,
thereby reducing dielectric and insertion loss, which results in
higher gains and efficiencies in amplifiers and antennas. Its
increased thermal conductivity handles higher power, reduces
hot-spots, and boosts device reliability.
TC350 laminates are effective in designs with limited thermal
management, improving heat transfer through the laminate, lowering
junction temperatures, and extending the lifespan of active
components. Its lower operating temperatures and matching thermal
expansion characteristics with chips enhance component attachment
reliability, reducing issues like solder fatigue and joint failure.
Features and Benefits
The TC350 laminate has a Dk of 3.5, ensuring precise impedance
control and efficient signal transmission in high-frequency
applications.
It exhibits excellent thermal conductivity of 0.72W/m-K, allowing
for effective heat dissipation through the laminates.
TC350 maintains low thermal coefficient of Dk at -9 ppm/°C (-40°C
to 140°C) minimizing the impact of temperature changes on the PCB,
ensuring reliable signal transmission.
It features a low loss tangent of 0.002 at 10GHz, resulting in
minimal signal loss. This feature improves bandwidth utilization
and increases the efficiency of amplifiers and antennas operating
at high frequencies.
TC350 exhibits low coefficients of thermal expansion on X, Y, and Z
axes (7, 7, and 23 ppm/°C, respectively), providing reliable plated
through hole connections and excellent dimensional stability.
PCB Capability
| PCB Material: | Woven Fiberglass Reinforced, Ceramic Filled, PTFE Composite |
| Designation: | TC350 |
| Dielectric constant: | 3.5±0.05 |
| Thermal Conductivity | 0.72 W/m-K |
| Dissipation Factor | Df .002@10 GHz |
| Layer count: | Single Layer, Double Layer, Multi-layer, Hybrid PCB |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil (1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin,
ENEPIG, Pure gold etc.. |
Our PCB manufacturing capability allows for the production of
single -sided, double-sided, multi-layer boards, and hybrid PCBs.
You can choose from copper weight options of 1oz (35µm) and 2oz
(70µm).
We accommodate various PCB thicknesses, including 10mil, 20mil,
25mil, 60mil, and 125mil, and the maximum PCB size we can
manufacture is 400mm X 500mm.
We offer multiple solder mask options such as green, black, blue,
yellow, and red, as well as different surface finish options
including bare copper, HASL, ENIG, OSP, immersion silver, immersion
tin, ENEPIG, pure gold and so on.
Applications
TC350 finds widespread applications in power amplifiers, filters,
couplers, tower-mounted amplifiers (TMA), tower-mounted boosters
(TMB), microwave combiner and power dividers etc.
Thank you. See you next time.
