Al₂O₃(96%) Ceramic PCB Built on Double Sided 1.0mm Substrates with 1oz 35um Copper and Immersion Gold for IGBT Heat Dissipation

(All Ceramic PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

I. Brief Introduction

This ceramic PCB is made from high-quality AL2O3 (96%) ceramic material, offering excellent thermal conductivity, insulation, and mechanical strength. It features a 2-layer design with 1mm dielectric thickness. The 1oz copper on both sides ensure superior conductivity and signal transmission quality. No solder mask or silkscreen characters are applied. Its surface is plated with immersion gold with a 2 micro-inch thickness, endowing it with excellent solderability, oxidation resistance and corrosion resistance. It is suitable for electronic devices requiring high power, high frequency, and high reliability.

II. Basic Specifications

Board dimensions: 98mm x 98mm=1PCS, +/- 0.15mm

Minimum Trace/Space: 6/6 mils

Minimum Hole Size: 0.3mm

No Blind vias.

Finished board thickness: 1.1mm

Finished Cu weight: 1oz (1.4 mils) outer layers

Via plating thickness: 20 μm

Surface finish: Immersion Gold

Top Silkscreen: No

Bottom Silkscreen: No

Top Solder Mask: No

Bottom Solder Mask: No

100% Electrical test used prior to shipment

PCS Specifications

III. Introduction of Al₂O₃ 96% Ceramic Material

The 96% purity alumina ceramic copper-clad laminate is a high-performance electronic substrate material, composed of a 96% alumina (Al₂O₃) ceramic substrate and a high-purity copper layer laminated on the surface. The ceramic substrate is made through a precision sintering process, and the copper layer is strongly bonded to the ceramic by Direct Bonded Copper (DBC) or Active Metal Brazing (AMB) technology, combining structural stability and functional characteristics.

Characteristics

High Thermal Conductivity: The thermal conductivity of 96% alumina is approximately 24 - 28 W/(m·K), which can effectively conduct the heat generated by high-power devices, outperforming ordinary PCB base materials.

Excellent Insulation: The ceramic substrate has a high resistivity (＞10¹⁴ Ω·cm) and a breakdown voltage of 15 - 20 kV/mm, ensuring circuit safety.

Thermal Expansion Matching: The coefficient of thermal expansion of alumina is close to that of silicon chips (~7.1×10⁻⁶/℃), reducing the risk of failure caused by thermal stress.

High Mechanical Strength: The flexural strength is ≥300 MPa, and it can withstand high temperatures (long - term operating temperature ＞800℃), adapting to harsh working environments.

Cost-effectiveness: Compared with 99% high-purity alumina, 96% purity reduces raw material costs while maintaining performance, making it suitable for large-scale applications.

Core Processes

Surface Metallization: Through the DBC process, an eutectic layer is formed on the surface of alumina by oxidation, and then bonded to the copper foil at high temperatures (above 1065℃); or the AMB process is used to achieve low-temperature brazing through active solder.

Precision Pattern Formation: Lithography and etching techniques are used to process micro-circuits on the copper layer to meet the requirements of high-density packaging.

Application Fields

Power Electronics: IGBT modules, new energy vehicle motor controllers, photovoltaic inverters, etc., to carry high currents and dissipate heat quickly.

LED Lighting: As a COB (Chip - on - Board) substrate, it improves the heat dissipation efficiency and lifespan of high - power LEDs.

RF/Microwave Devices: Used in high-frequency circuits of 5G communication base stations and radar systems. The low dielectric loss (tanδ＜0.001) ensures signal integrity.

Aerospace: Its high - temperature resistance and radiation - resistance characteristics are suitable for satellite power systems and avionics equipment.

Comparison and Advantages

Compared with aluminum nitride (AlN) or silicon nitride (Si₃N₄) substrates, the 96% alumina copper-clad laminate has more advantages in terms of cost and process maturity; compared with epoxy - resin - based PCBs, its heat - resistance and thermal conductivity are significantly improved, making it suitable for scenarios with a power density ＞100 W/cm².

Development Trends

With the miniaturization and high-powerization of electronic devices, this material is developing towards ultra - thin types (substrate thickness ＜0.2 mm), multi - layer structures and 3D integration. At the same time, its thermo-mechanical properties are optimized through doping modification, expanding to emerging fields such as new energy and smart grids.

Data Sheet

1.Ceramic Parameters

2. Material Thickness

IV. Our PCB processing Capability

We can process precision circuits with a line width/space of 3mil/3mil and a conductor thickness of 0.5oz-14oz. We also has processing capabilities such as micro-via filling, the inorganic dam process, and 3D circuit fabrication.

We can handle different processing thicknesses, such as 0.25mm, 0.38mm, 0.5mm, 0.635mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm, etc.

We offer diversified surface treatments, including Electroplated gold process (1-30u"), Electroless Nickle Palladium Immersion gold process (1 - 5u"), Electroplate silver process (3 - 30um), Electroplated nickel process (3 - 10um), Immersion tin process (1 - 3um), etc

Bicheng PCB is headquartered in Shenzhen, a city with great economic vitality. Based in China, we adhere to the philosophy of servicing small and medium sized companies offering variety of circuit boards to meet the demands of market.

We maintain the highest standards which support products that exhibit exceptional quality, performance and reliability. The circuit board ranges from conventional FR-4 to PTFE, metal core to flexible circuits which are used in the industries of home appliances, portable and consumable electronics, medical filed, aerospace as well as telecommunications etc.

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